Feb/March_AMP_Digital

A D V A N C E D M A T E R I A L S & P R O C E S S E S | F E B R U A R Y / M A R C H 2 0 2 1 2 9 days of continuous data acquisition (see Figs. 3 and 4). DRIVING HIGH-THROUGHPUT PERFORMANCE IN COMMERCIAL LABORATORIES By switching to ICP-OES technol- ogy and advanced software, labora- tories can reduce laborious and manu- al sample preparation steps from REE analysis workflows and streamline their analytical procedures. Matrix robust- ness and reduced interference through interelement correction software en- sure a high spectral resolution while maintaining a high linearity range. These automated e-workflows lower training requirements, allowing techni- cians to perform analyses and reducing the need for onsite specialists. In turn, automation leads to more accurate re- sults and higher throughput, driving greater laboratory productivity. Cost benefits are further realized through the lower capital outlay needed for in- vestment in ICP-OES technology and the significant savings in operation- al expenditure through the removal of clean-room requirements and expen- sive high-purity dilution acids. The applications for ICP-OES do not stop with REEs—this flexible tech- nique is being embraced by other in- dustries looking to reduce the cost of effective detection of trace elements, including the study of platinum group elements, analysis of the production of metals and alloys, and the investiga- tion of environmental waste streams. Just as in REE analysis, ICP-OES is be- ing used throughout lifecycles, from ore exploration to final products and their reuse. The detection and analysis of REEs and other recoverable materials in e-waste and environmental samples are crucial to embracing a sustainable model for electronics manufacturing in times when recycling and reusing is more important than ever—it is a Fig. 3 — Final calculated concentrations (µg/g) of REEs and metals in undiluted samples of mobile phone components: TFT screens, PCBs, and magnets from the speakers. Fig. 2 — Disassembled mobile phone components selected for analysis: TFT screens, speaker magnets, and PCBs.