September_AMP_Digital

ISTFA.ORG SPECIAL CONTESTS See the winners of the EDFAS Video Contest, featuring three-minute videos on failure analysis, as well as the best of the EDFAS Photo Contest, with categories in optical microscopy, SEM/TEM/x-ray/UVmicrographs, and photon emissions. First PlaceWinner in Color images, 2019 EDFAS Photo Contest. Courtesy of Kevin Awai, Raytheon. First PlaceWinner, 2019 EDFAS Video Contest. Courtesy of Sandeep Kullar, Nordson Dage. TUESDAY, NOVEMBER Dr. TimBrosnihan, executive director of MEMS and Sensors Industry Group at SEMI, will talk on “Sensitization: How MEMS Technology is Enabling Our Digital World” including a brief history of MEMS, description of fabrication technology, and discussion of howMEMS are enablingmarket megatrends such as autonomous driving, smart med tech, machine learning, and biometrics. KEYNOTE SESSION Brosnihan exhibitor list Advantest Corporation Allied High Tech Products AngstromScientific, Inc. Applied Beams Barnett Technical Services Bruker Corporation BSET EQ Checkpoint Technologies Contech Solutions Inc. Control Laser Corp. CORIAL DC - Digit Concept EAG Laboratories Ebatco ElectronMicroscopy Sciences Gatan EDAX Hamamatsu Corporation HDI Solutions - Hitachi Herzan LLC Hi-Rel Laboratories Hitachi High Technologies ibss Group Imina Technologies SA Integra Technologies Ironwood Electronics JEOL USA JIACO Instruments Keyence Corporation Kleindiek Inc. LatticeGear Leica Microsystems MASER Engineering B.V. Materials Analysis Technology Mentor, A Siemens Business MEO Engineering Company, Inc. Microsanj LLC MSSCORPS Co., Ltd. Neocera LLC NikonMetrology Nippon Scientific Co., Ltd. Nisene Technology Group, Inc. North Star Imaging OKOS Olympus Oxford Instruments Park Systems Inc. Photothermal Spectroscopy Corp. PIE Scientific LLC PVA TePla America Inc. QuantumFocus Instrument Quartz Imaging Raith America, Inc. RKD Engineering RKD Systems Robson Technologies Inc. SELA USA Inc. SEMICAPS SmarAct Inc. Solecon Labs SPI Supplies, Inc. Synopsys Ted Pella, Inc. TeraView LTD TESCANUSA Thermo Fisher Scientific Trion Technology TSSMicroscopy ULTRA TEC Varioscale Inc. XEI Scientific ZEISS Zurich Instruments USA, Inc. *Exhibitor list current as of August 24. TECHNICAL PROGRAM TOPICS • 3D Device Failure Analysis • Board and System Level FA • FIB Circuit Analysis and Edit • Competitive Analysis and Reverse Engineering • Detecting Counterfeit Microelectronics • Diagnostic Testing, Scanning, and Debug • Emerging FA Techniques • Electronic Device Materials Characterization • Energy • FA Process • FA Techniques Addressing the Challenges of Heterogeneous Systems in Package • Future Challenges of FA • Metrology and In-lineDeviceCharacterization • Microscopy • Nanoprobing andElectrical Characterization • Novel Memory FA • Organic Electronic (OLED) • Power, Discretes, and Optoelectronic Device FA • Packaging and Assembly Level FA • Quantum Circuit FA • Sample Preparation and Device Deprocessing • Scanning Probe Analysis • Silicon Photonics FA • Wireless, Self-Powered Sensors • MEMS Failure Analysis • Yield and Reliability Enhancement EXHIBIT HOURS TUESDAY, NOVEMBER | : A.M. – : P.M. WEDNESDAY, NOVEMBER | : A.M. – : P.M