September_AMP_Digital

PASADENA CALIFORNIA PASADENA CONVENTION CENTER NOVEMBER 15-19 The 46th International Symposium for Testing and Failure Analysis (ISTFA), the premier conference and exhibition for themicroelectronics failure analysis community, is scheduled for November 15 – 19 in Pasadena, California. This year’s theme—The Rise of MEMS and 3D Failure Analysis—will be evident throughout the event in user group meetings, technical presentations, and keynote. The conference also includes the highly popular EDFAS video and photo contests. ISTFA once again o ers the opportunity to take an immersive half or full-day educational course. This year’s tutorial programextends the learning process to awider selection of topics. The technical sessions feature over 100 presentations of original unpublished work in areas such as sample preparation and device deprocessing, fault isolation, silicon photonics FA, scanning probe analysis, and emerging FA techniques and concepts. New this year is a student poster competition, which aims to foster exchanges between the academicworld and the failure analysis engineering community. ISTFA’s keynote speaker, Dr. Tim Brosnihan, executive director of MEMS and Sensors Industry Group at SEMI, has more than 25 years of experience in the MEMS industry working in small start-ups as well as large corporations. This talk includes a history of MEMS, its fabrication technology, and how MEMS are enabling market megatrends such as autonomous driving, smart med tech, machine learning, and biometrics. The Expo features key companies showcasing the best technologies and products in the industry. EDUCATION WORKSHOPS • ESD – FA Instructor: Dr. Steven H. Holdman • Review of Scanning Probe Microscopy Methods Instructor: Dr. Peter De Wolf • Beam-Based Defect Localization Instructor: Dr. Ed Cole, Jr., FASM • Optical, Infrared, and FA Microscopy Instructor: Mr. John McDonald For dates, times, and full course descriptions, visit istfa.org . TUTORIALS An expanded tutorial program addresses 22 topics, including two new ones: • Microscopy: Charged Particle Systems: Fundamentals & Opportunities • 3D Device: 3D Device/Package Fault Isolation and Failure Analysis ISTFA 202 The Rise of MEMS and 3D Failure Analysis SHOW PREVIEW 46TH INTERNATIONAL SYMPOSIUM FOR TESTING AND FAILURE ANALYSIS ORGANIZING PARTNER: CORPORATE SUPPORTER: sponsored by: ORGANIZED BY: