July/August_AMP_Digital

4 A D V A N C E D M A T E R I A L S & P R O C E S S E S | J U L Y / A U G U S T 2 0 2 0 ASM International 9639 Kinsman Road, Materials Park, OH 44073 Tel: 440.338.5151 • Fax: 440.338.4634 Joanne Miller, Editor joanne.miller@asminternational.org Victoria Burt, Managing Editor vicki.burt@asminternational.org Ed Kubel, Frances Richards, and Corinne Richards Contributing Editors Jan Nejedlik, Layout and Design Kelly Sukol, Production Manager kelly.sukol@asminternational.org Press Release Editor magazines@asminternational.org EDITORIAL COMMITTEE Adam Farrow, Chair, Los Alamos National Lab John Shingledecker, Vice Chair, EPRI Somuri Prasad, Past Chair, Sandia National Lab Surojit Gupta, University of North Dakota Nia Harrison, Ford Motor Company Michael Hoerner, KnightHawk Engineering Hideyuki Kanematsu, Suzuka National College of Technology Ibrahim Karaman, Texas A&M University Scott Olig, U.S. Naval Research Lab Amit Pandey, Lockheed Martin Space Satyam Sahay, John Deere Technology Center India Anand Somasekharan, Los Alamos National Lab Kumar Sridharan, University of Wisconsin Jaimie Tiley, U.S. Air Force Research Lab Jean-Paul Vega, Siemens Energy ASMBOARDOF TRUSTEES Zi-Kui Liu, President and Chair of the Board Diana Essock, Vice President David U. Furrer, Immediate Past President Toni Marechaux, Interim Treasurer Prem K. Aurora Diana Lados Thomas M. Moore Jason Sebastian Larry Somrack Judith A. Todd Priti Wanjara Ji-Cheng Zhao Ron Aderhold, Secretary and Acting Managing Director STUDENT BOARDMEMBERS Kimberly Gliebe, Ashwin Kumar, Nisrit Pandey Individual readers of AdvancedMaterials & Processes may, without charge, make single copies of pages therefrom for per- sonal or archival use, or may freelymake such copies in such numbers as are deemed useful for educational or research purposes and are not for sale or resale. Permission is granted to cite or quote fromarticles herein, provided customary acknowledgment of the authors and source is made. The acceptance and publication of manuscripts in Advanced Materials & Processes does not imply that the reviewers, editors, or publisher accept, approve, or endorse the data, opinions, and conclusions of the authors. R ecently, I have had access to some top-notch minds in materials science fromaround the globe, all whilework- ing remotely from home. From ASM webinar speakers and virtual session presenters, to authors, panelists, and edi- torial boardmembers—they all contributed to the richness of this issue on additivemanufacturing. Roger Narayan, FASM, is co-author of the state-of- the-art 3D bioprinting article in this issue. Through him, I learned about the top nine technical challenges in the field of additive manufacturing (AM) as outlined by John Slotwinski of the Johns Hop- kins University Applied Physics Laboratory. Here are his top five: (1) understand- ing materials properties, (2) creating design-allowable materials data, (3) devel- oping additive feedstock materials, (4) developing a better understanding of AM processes, and (5) developing a certification process for AM-produced devices. Elizabeth Holm, professor at Carnegie Mellon University, might agree. She is among the IMAT panelists featured in our Q&A story on page 32, which addresses how artificial intelligence and machine learning can aid AM. She shared with me that process qualification is key—both the design and qualification of materials for additive need to be examined. She says it’s imperative to evaluate raw mate- rials as well as build outcomes. Then I had an opportunity to see several virtual presentations, including one by Andrew Norman of the Europe- an Space Agency (ESA). From his talk, I learned that the ESA and NASA are collaborating on AM efforts for space applications. Specifically, they are fo- cused on the areas of standards and parts qualification. Yes, that’s Liz Holm applauding. Norman’s talk was part of an ASM-hosted AeroMat Virtual Session on June 2 that attracted 775 registrants and gave a platform to six speakers from the spring technical program (thwarted by COVID-19). The first-time online event exceeded organizers’ expectations and garnered positive feedback from attendees. A few weeks later, the ITSC 2021 Virtual Session on “Coatings for Anti-Virus, Bacteria, and Fungus Applications” was equally engaging and successful. Speak- ers from Australia, Canada, China, and Spain presented 15-minute previews of the presentations they will give at ITSC 2021 in Quebec, May 24-27. For snippets from the virtual event, see the iTSSe supplement in this issue. Thrilling for me, during his talk, Javad Mostaghimi of the University of To- ronto cited our AM&P digital-first article by Harold Michels, and Corinne Michels, “Can Copper Help Fight COVID-19?” Now, in this issue, we follow up with the sec- ond article in our Materials Science and Coronavirus Series. With all the renewed interest in copper for its antimicrobial properties in slowing the spread of virus- es, we present a synopsis of those surface-related benefits as well as a refresher on copper’s other beneficial properties. The copper article, leaning on tried and true ASM Handbook peer-reviewed knowledge, is a reminder that ASM gathers the best of the best in the materials science field as authors, instructors, and presenters. Virtually, the best. joanne.miller@asminternational.org VIRTUALLY THE BEST AeroMat virtual presentation slide by Robert Scudamore, TWI.