edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 25 NO. 3 56 Accelerated Analysis..............................................56 Allied High Tech................................................28-29 ASM International..................................................45 Checkpoint Technologies.................................18-19 Quantum Focus........................................................3 SEMICAPS............................... 35 / Inside back cover Ted Pella.................................................................27 TESCAN USA Inc............................Inside front cover Thermo Fisher...................................................10-11 ULTRA TEC................................................Back cover For advertising information and rates, contact: Kelly Johanns, Business Development Manager 440.671.3851, kelly.johanns@asminternational.org Current rate card may be viewed online at asminternational.org/mediakit. INDEX OF ADVERTISERS A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS ELECTRONIC DEVICE FAILURE ANALYSIS NOTEWORTHY NEWS IEDM 2023 The 69th International Electron Devices Meeting (IEDM 2023) will be held at the Hilton San Francisco Union Square, December 9-13. IEDM is a leading forum for reporting breakthroughs in the technology, design, manufacturing, physics, and modeling of semiconductors and other electronic devices. Topics of interest include circuit and device interactions; characterization, reliability, and yield; compound semiconductor and high-speed devices; memory technology; modeling and simulation; nano device technology; optoelectronics, displays, and imagers; power devices, process and manufacturing technology, and sensors, MEMS, and BioMEMS. IEDM is sponsored by the IEEE Electron Devices Society. For more information, visit ieee-iedm.org and watch for any updates to the meeting plan. Visit the Electronic Device Failure Analysis Society website edfas.org
RkJQdWJsaXNoZXIy MTMyMzg5NA==