edfas.org 53 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 25 NO. 3 PHANTOM REACTIVE ION ETCHER WITH INDUCTIVELY COUPLED PLASMA SOURCE The Phantom Reactive Ion Etcher (RIE) with inductively coupled plasma (ICP) source is designed to supply research and failure analysis laboratories with state-ofthe-art plasma etch capability on single wafers, dies, or packaged parts using fluorine and oxygen based chemistries. The system has a compact, modular design built on a spacesaving platform. Trion’s carefully engineered ICP is a proven option for applications requiring a downstream, high-density plasma source. It dramatically reduces radiation damage and contamination from RIE sputtering and greatly increases selectivity to other films. It allows for higher plasma densities as power is transferred into Trion Technolgy’s Phantom RIE/ICP. the bulk plasma via the magnetic field resultant from inductive coupling. This enables processing at lower pressure, which has a number of significant benefits. It allows for tight anisotropy in high aspect ratio structures and reduces microloading effects. Trion’s ICP source will result in improved etch rates, profile control, uniformity, and selectivity with a dramatic reduction in RIE radiation damage. The ICP comes with a 600 or 1250 watt, 13.56 MHz power supply and a built in automatic matching network. A color flat panel display with touch screen interface provides the operator with full process information at all times. The software interface guides the operator through each sequence in a logical fashion and gives fingertip control of all process parameters. The PC process controller provides simple and reliable system control. The graphical software package creates programs in block diagram form. Process recipes are stored on the hard drive or can be stored on USB flash drives allowing each operator to maintain individual recipes. The Phantom meets SEMI S2-93 safety requirements. The system is CE compliant with Machinery Directive 98/37/EC, the Low Voltage Directive 73/23/EEC, and the Electromagnetic Compatibility Directive 89/336/EEC for CE marking requirements. For more information, visit triontech.com. NOTEWORTHY NEWS ESREF 2023 The 34th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2023) will take place October 2-5 in Toulouse, France. This international symposium has a focus on reliability in all aspects of electronics including new applications in extremely harsh environments such as space, transport, energy conversion, and smart functions. It provides the leading European forum for developing all aspects of reliability management and innovative analysis techniques for present and emerging semiconductor applications. For more information, visit esref2023.sciencesconf.org.
RkJQdWJsaXNoZXIy MTMyMzg5NA==