edfas.org 39 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 25 NO. 3 The heart of ISTFA is the technical program, and this year promises to be another great one with more than 20 technical sessions, including a new session on power devices (Si, SiC, and GaN) with a special view to GaN high-electron-mobility transistor (HEMT) technologies and SiC devices and related failure modes. For the first time, authors will have the opportunity to publish their contributions additionally within a special issue of ASM’s Journal of Failure Analysis and Prevention. Wide bandgap power electronics and ESD/EOS failure analysis themes will be featured in the tutorial program. The tutorial program will, as always, be packed with interesting offerings in fault isolation, microscopy, package, physical, and machine learning analysis. The education short courses that traditionally run on Saturday as a kickoff to the conference, allow participants greater insights into key topics such as beam-based defect localization or failure analysis of electronic devices. Another key element of ISTFA are the user groups, which provide an interactive platform to discuss best practices, current problems, and future trends in failure analysis, closely aligned to the EDFAS road map. For 2023, a new user group has been added that will delve into standardized and AI-enhanced FA workflows. Furthermore, the results of the FA technology roadmap will be discussed within the different groups to get additional input and feedback. Another fixture of ISTFA is the Expo, which showcases the latest products and service for all areas pertinent to the failure analysis field. The Expo area is also a great gathering place where you can reconnect with colleagues or make new contacts, while browsing the booths and enjoying some refreshments. We are happy to announce that more than 50 exhibitors have already signed up for the expo this year. After a successful restart of ISTFA as an in-person event last year, I look forward to welcoming you to Phoenix this November for networking and profes- sional growth. A stroll through downtown Phoenix. Hyatt Regency Phoenix, the conference hotel. ISTFA 2023 TECHNICAL SESSIONS Symposium sessions will be packed with high quality, innovative, and original unpublished pre- sentations: • New: Power Devices (Si, SiC, GaN) • AI Applications for Failure Analysis • Board and System Level FA • Case Studies: Device Analysis • Detecting and Preventing Counterfeit Microelectronics • Die Level Fault Isolation • Emerging FA Techniques and Concepts • FIB Circuit Edit • FIB Sample Preparation • Hardware Security and Counterfeiting • Microscopy Analysis and Materials Characterization • Nanoprobing and Electrical Characterization • Package Level Fault Isolation • Packaging and Assembly • Product Yield, Test, and Diagnostics • Sample Preparation and Device Deprocessing • Scanning Probe Analysis • System in Package and 3D Devices
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