edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 25 NO. 3 38 PREVIEW ISTFA 2023 Frank Altmann, ISTFA 2023 Conference Chair Fraunhofer IMWS frank.altmann@imws.fraunhofer.de The theme of the 49th International Symposium for Testing and Failure Analysis (ISTFA), which will be held in Phoenix this year from November 12 to 16, is “Moving Toward Reliable Power Electronic Devices.” Saving global resources by increasing energy effic- iency is among the most significant problems that global society must address today. To achieve this, a major target is developing efficient and reliable power electronic devices for providing the required high-performing hardware components. Power semiconductors based on silicon carbide (SiC) and gallium nitride (GaN) technologies are becoming increasingly important since they allow smaller sizes, lighter weight, lower costs, and higher efficiency of power electronics systems. For these innovative components, there are still many issues to be resolved regarding the lack of robustness and reliability. This arises from significant failure risks during manufacturing and consequently may form roadblocking obstacles on the way to the mass market. The complexity of highly integrated SiC and GaN devices requires an in-depth understanding of defect formation and degradation mechanisms as well as adapted failure analysis metho- dologies. Wide-bandgap power devices and related robustness and reliability aspects will also be the focus of the keynote presented by Dr. Peter Friedrichs, vice president SiC at Infineon. His talk will give insight into specific aspects regarding long term reliability and failure modes of SiC power devices, considering application relevant mission profiles. Dr. Friedrichs holds numerous patents in the field of SiC power devices and technology and has authored or co-authored more than 50 scientific papers and conference contributions. This year’s panel discussion will be centered around power electronics design, quality, failure analysis, and reliability. Discussion points will include wide bandgap power electronic technology trends, related reliability issues, and failure analysis approaches. Experts from both academia and the semiconductor industry have been invited to participate. The Phoenix Convention Center.
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