edfas.org ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 25 NO . 1 8 17. M. Mecklenburg, et al.: “ElectronBeam-inducedCurrent Imagingwith Two-angstromResolution,” Ultramicroscopy, Vol. 207, p. 112852, Dec. 2019, doi: 10.1016/j.ultramic.2019.112852. 18. W.A. Hubbard, et al.: “Scanning Transmission Electron Microscope Mapping of Electronic Transport in Polycrystalline BaTiO3 Ceramic Capacitors,” Appl. Phys. Lett., 115(13), p. 133502, Sep. 2019, doi: 10.1063/1.5117055. 19. M. Mecklenburg, et al.: “Electrical Isolation Preserved by Plasma Focused Ion Beam TEM Sample Preparation and Verified with STEM SEEBIC Imaging,” Microsc. Microanal., p. 1–3, Jul. 2020, doi: 10.1017/ S1431927620013756. ABOUT THE AUTHOR William A. Hubbard received a B.S. in physics and mathematics from Boston University in 2008, after which he worked as a research assistant in the Harvard University Physics Department until 2010. He received his Ph.D. in experimental condensed matter physics in 2017 from UCLA, where he was also a postdoctoral scholar until 2019. He is currently the CEO of NanoElectronic Imaging Inc., where his research focuses on developing electronmicroscopy based techniques, such as STEMEBIC, which can visualize electronic and thermal contrast in operating nanodevices. NOTEWORTHY NEWS FIB SEMMEETING 2023 The 15th annual FIB SEM Meeting will be held June 11-16, in conjunction with IUMAS 8 in Banff, AB Canada. FIB SEM will feature presentations, tutorials, and posters by FIB users and vendors, highlighting new applications and the latest technology. The event offers plenty of technical content as well as opportunities for informal discussions with your FIB colleagues. FIB SEM 2024 will be held back in the Maryland/DC area. For more information, visit fibsem.net or email keana.scott@nist.gov. IRPS 2023 The IEEE International Reliability Physics Symposium’s (IRPS) annual conference will be held March 26-30, 2023, in Monterey, Calif. The IRPS technical program includes technical sessions, keynotes, and invited talks on emerging issues, tutorials, workshops, poster sessions, a year-in-review seminar, and equipment demonstrations. IRPS 2023 is soliciting increased participation in the following areas: circuit reliability and aging, 3D IC advanced packaging, neuromorphic computing; and more. The IRPS Conference is sponsored by the IEEE Reliability Society and IEEE Electron Devices Society. For more information, visit the IRPS website at irps.org and watch for any updates to the meeting plan.
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