edfas.org 55 ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 25 NO . 1 be employed to benefit analysis efficiency and reduce tool downtime. Standardized FI- FA flows assisted by automation and AI are highly desired for next generation package failure analysis. Collective efforts fromworldwide FA community need to be taken to set up standards and fulfill the FA technology gaps. To read and comment on EDFAS FA Technical Roadmap papers as they become available, visit the EDFAS Community site at connect.asminternational.org.
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