edfas.org ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 25 NO . 1 46 deprocessing, including parallel lapping, dry and wet etching, reactive ion etching, STEM prep and imaging, dye and pry (BGA devices), decapping and depotting (ICs), solderability analysis, photo emission microscopy (PEM), liquid crystal analysis, LIVA/TIVA analysis, thermal imaging, and electrical probing. MATERIALS ANALYSIS TECHNOLOGY (MATEK) TAIWAN LAB +886.3.6116678 ext 2621 fib@ma-tek.com www.matek.com/home Services Offered: Materials analysis, structure analysis, surface analysis, failure analysis, and reliability tests. Tools and Techniques: Optical microscopes (3D OM, UV OM), 2D x-ray, SAT, optical profilers, TDR, SEM-FIB plan-view, cross-sectional X-S SEM analysis with ESD, TEM sample preparation, IC reverse engineering, passive voltage contrast (PVC), IC circuit repair, ion channeling contrast, FIB circuit edit, TEM, EBSD, EELS, chemical decap, laser decap, delayer and parallel lapping, ion milling, packaging and bonding, rework station, laser reballing, biomedical and organic sample preparation, AFM- based nano-probing, SEM-based nano-probing, EBIC/ EBAC, EBIRCH, PEM-CCD, PEM-InGaAs, OBIRCH, thermal EMMI, C-AFM, AFM, thin film analyzer, FTIR, HRXRD, SRP, SIMS, SCM, XPS/ESCA, XRF, FE-AES, reliability test service, component level RA service, board level RA service, system level RA service, ESD testing, and design services. MUANALYSIS INC. 2301 St. Laurent Blvd., Suite 500 Ottawa, Ontario Canada K1G 4J7 866.238.4664 info@muanalysis.com sales@muanalysis.com muanalysis.com/contact-us Services Offered: Testing, microscopy, analysis, sample preparation, spectroscopy, and qualifications. Tools and Techniques: ESD and latchup testing, environmental testing, electrical testing, shear, bend, and tensile testing, solderability testing, emissionmicroscopy (EMMI), laser scanning microscopy (LSM), confocal scanning acousticmicroscopy (CSAM), liquid crystal, scanning electron microscopy, optical microscopy, optical beam induced current, LED and luminaire failure analysis, counterfeit detection materials integrity verification, BGA layer by layer construction analysis, x-ray imaging, sample preparation, delayering, and cross-sectioning for FA, decapsulation and repackaging of ICs, FTIR, Raman spectroscopy, energy dispersive x-ray, x-ray fluorescence (XRF), fabrication support, MuAnalysis joint integrity characterization (MAJIC), temperature cycling, process, package and product qualifications, and expert witness services. WATSON ANALYTICAL LLC 4795 Eastgate Mall, Suite 100 San Diego, CA 92121 858.761.2258 info@watsonanalytical.com www.watsonanalytical.com/about-us Services Offered: Electrical characterization, reliability test services, construction analysis, product reliability testing, customtests solutions, customdebugandanalysis solutions, nondestructive testing, destructive testing, fault isolation,materials characterization, and support services. Tools and Techniques: Passive microprobing, active microprobing (dc to 3GHz), RF/microwave coplanar probing (GSG, GS, probes), parametric measurements, pulsed I/V measurements, RF characterization, digital characterization, DC characterization, high temp operating life (HTOL), custom high temp operating life (HTOL), high temperature reverse bias (HTRB), high temperature gate bias (HTGB), high temperature storage life (HTS), high humidity high temperature reverse bias (H3TRB), temperature cycle (TC), low temperature storage life, low power opticalmicroscopy, highpower opticalmicroscopy, scanning acoustic microscopy, radiographic examination, optical measurements, decapsulation, sample potting/mounting, mechanical cross-section, mechanical delayering, reactive ion etching, photon emission microscopy, lock-in thermography, thermal mapping, externally induced voltage alteration (XIVA), thermally induced resistive change (TIVA), OBIRCH, soft defect localization (SDL), latent defect alteration (LADA), optical beam induced current (OBIC), electrical beam induced current (EBIC), passive voltage contrast, active voltage contrast, thermionic SEM, fieldemission scanning electron microscopy, and EDS. Advertise in Electronic Device Failure Analysis magazine! For information about advertising in Electronic Device Failure Analysis: Kelly Johanns, Business Development Manager 440.671.3851, kelly.johanns@asminternational.org Current rate card may be viewed online at asminternational.org/mediakit.
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