edfas.org 45 ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 25 NO . 1 DIRECTORY OF INDEPENDENT FA PROVIDERS Rosalinda M. Ring, Thermo Fisher Scientific jmj4papa@yahoo.com Electronic companies of all types and sizes require failure analysis (FA) services. Our goal is to supply a resource of FA service providers for your reference files. The directory lists independent providers and their contact information, expertise, and types of technical services offered. ADVANCED CIRCUIT ENGINEERS (ACE) 308 S. Abbott Ave. Milpitas, CA 95035 408.719.1617 sales@advancedcircuitengineers.com www.advancedcircuitengineers.com/contact Services Offered: TEM, dual-beam, and FIB circuit edit. Tools and Techniques: FIB circuit edit, TEM–STEM, EDX, dual-beam/FIB cross section, and electron backscatter diffraction (EBSD). FAILURE ANALYSIS INSTRUMENTS (FAI) INC. 36217 Worthing Dr. Newark, CA 94560 510.851.5555 info@fainstruments.com www.fainstruments.com Services Offered: Full contract failure analysis laboratory services and FA tools development (electrical engineering, mechanical engineering, andPythonandCprogramming), training, and consulting. Tools and Techniques: Sample preparation (backside thinning, decapsulation), crystal vision (CCD and InGaAs camera), analytical products for photovoltaic components, coherent laser illuminator, UV/thermal controller, stimulus induced fault testing (SIFT), fluorescence micro-thermal imaging (FMI), Moiré thermal imaging, liquid crystal analysis, parametric analyzer, and upgrade cameras. HI-REL LABORATORIES INC. 6116 N Freya St. Spokane, WA 99217 509.325.5800 trevor.devaney@hrlabs.com www.hrlabs.com Services Offered: Materials analysis of electronic components and assemblies, destructive physical analysis (DPA), failure analysis of electronic components, materials analysis, and upgrade services which includes real time x-ray, PIND, and hermeticity testing. Tools andTechniques: C-SAM, real-time x-ray, 3DCT x-ray, SEM, SEM+ energy dispersive x-ray spectroscopy, FTIR, FIB sectioning, optical microscopy, and EDXRF. INSCOPE LABS PTE. LTD. 11 Ubi Road 1, #07-01 Singapore 408723 65.6779.3735 sales@inscopelabs.com www.inscopelabs.com/contact-us.htm Services Offered: Electrical fault localization, material analysis, and sample preparation. Tools and Techniques: Photon emission microscopy, multi-laser NIR scanning optical microscopy (1064 nm laser capable of electron-hole pair generation through backside silicon and 1340 nm laser high resolution thermal probe which allows localized heating), SEM and EDS analysis, topography contrast, grain size, surface structure, atomic contrast, phase analysis, elemental and chemical analysis, contamination analysis, x-ray analysis, Sonix scanning acousticmicroscope, sample preparation, mechanical polishing, chemical decapsulation, crosssection sample preparations (SEM and FIB), TEM sample preparations (mechanical polishing and focus ion beam (FIB), and sputter coating of sample (Au or Cr). INSIGHT ANALYTICAL LABS (IAL) 11641 Ridgeline Dr. Suite 150 Colorado Springs, CO 80921 719.570.9549 info@ial-fa.com www.ial-fa.com Services Offered: Integrated circuit failure analysis, discrete electronic devices, MEMS failure analysis, destructive analysis, construction analysis, PCB quality inspections, counterfeit IC detection, microelectronics inspections, package integrity testing, x-ray inspections, RoHSauditing, and wafer lot acceptance. Tools and Techniques: X-ray inspection, 2D real-time, and 3D scanning acoustic microscopy services (including c-mode scanning), optical inspection (dark field, bright field, polarized, high-resolution mosaic functionality), electrical test equipment, infrared (IR) microscopy, x-ray fluorescence (XRF), Fourier transform infrared (FTIR), energy dispersive spectroscopy (EDS), hi-pot and insulation resistance testing, dual-beam FIB, cross sectioning of ICs and PCBs (mechanical and FIB), FIB editing, scanning electron microscopy lab (SEM and FE-SEM), IC
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