edfas.org 41 ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 25 NO . 1 2022 EDFAS AWARD WINNERS EDFAS AWARD WINNERS: RECOGNIZING SERVICE James Demarest, FASM, Chair, EDFAS Awards and Nominations Committee Immediate Past President, EDFAS jjdemar@us.ibm.com The ASM Electronic Device Failure Analysis Society established two awards to recognize the accomplishments of its members. I am pleased to highlight the 2022 winners. The EDFASLifetimeAchievement Award recognizes thosewhohave given their time, knowledge, and abilities toward the advancement of the electronic device failure analysis industry. The 2022 awardee is Michael Bruce, a consultant at Semicaps Ptd. Ltd. and other organizations. His citation reads: “for his lifetime contributions to the advancement of backside failure analysis techniques and the development and adoption of soft defect localization, which has become a mainstay tool across the semiconductor industry.” Michael Bruce has over 27 years of experience in the semiconductor industry applying opticalbased fault isolation techniques. He has a B.S. and Ph.D. in physics from the University of Texas at Austin and conducted post-doctoral research in chemical physics at Indiana University. He worked for 14 years at Advanced Micro Devices Inc., where he developed many optical-based tools and techniques for debug of microprocessors including soft defect localization (SDL) for isolating speed paths in ICs, single-element time-resolved emission (TRE), and resistive interconnect localization (RIL). He currently provides technical consultation to Semicaps and many other organizations. Mike holds 76 patents and has published numerous papers in refereed journals and conferences, including a best paper and an outstanding paper at ISTFA for RIL and SDL, respectively. He is a past Editor of Electronic Device Failure Analysis magazine and has served on numerous technical committees at Sematech, ISTFA, IPFA, and IRPS. The EDFAS President’s Award recognizes those who provided an exceptional amount of effort in their service to the Society. The 2022 awardee is Becky Holdford, retired from Texas Instruments. Her citation reads: “for extensive contributions to EDFAS exemplifying a volunteer and continuous involvement as a board member, organizer, tutor, and session chair helping to make EDFAS and ISTFA exceptional.” Becky Holdford retired from Texas Instruments (TI) in Dallas “after 36 interesting years.” Becky joined TI in 1978 after graduating with honors from Southern Arkansas University Technical Branch. She spent most of her TI career (30+ years) in wafer fab and packaging failure analysis and holds three patents. She was a subject matter expert and trainer in cross-sectioning and SEM/FIB/EDX at TI. She has written papers and book chapters on semiconductor sample preparation. Her most recent work is the chapter on mechanically polished cross-sectioning of semiconductors in the Microelectronics Failure Analysis Desk Reference, 7th edition, published by ASM International in 2019. Becky is a charter member of EDFAS, has been an ISTFA paper reviewer, a session chair, a tutorial presenter, a tutorial chair twice, and has been an A/V chair. She was the editor of the 5th edition of the Microelectronics Failure Analysis Desk Reference. She served on the EDFAS Board of Directors (2016-2020), helped start the Lonestar Chapter of EDFAS and served as its president, vice-president, andwebmaster, andwas part of the teamthat startedWomen in Electronic Failure Analysis (WEFA). She is a longtime member of the Microscopy Society of America and a member of IEEE and SMTA. Currently, she is a part-time contractor at Raytheon Intelligence & Space in McKinney, Texas. Please joinme in thanking Michael Bruce and Becky Holdford for their significant contributions to inventing improved industry techniques and providing key research and education to benefit the FA community. To continue the recognition of worthy contributors, I urge you to send suggestions for next year’s award to me at jjdemar@us.ibm.com. Michael Bruce Becky Holdford
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