edfas.org ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 25 NO . 1 36 ISTFA 2022 returned to Pasadena, Calif., and with it brought the always energetic User Group Series back to our community. This year, in response to attendee survey results from previous years, we decided to introduce some fresh changes to the Series program. Our first change was to host dedicated, one-hour, non-competing User Group sessions. The secondwas to structure the sessions such that it offered more time for active discussion and less time for invited speakers. Our final changewas to separate the combined Optical and Nanoprobing session into their own dedicated sessions in order to address relevant optical fault isolation (OFI)/test/diagnosis and scanning/nanoprobing needs, respectively. These sessions complemented a full User Group suite which included the staple Focused Ion Beam (FIB), Sample Preparation, and System on Package (SOP) sessions. The impact of these changes will be detailed below by our session chairs; however, in general, some key highlights stoodout: 1) attendee counts increased significantly; 2) audience members remained enthusiastically engaged throughout by discussing matters important to them as analysts and shared their knowledge and experience openly with each other; and 3) participants included analysts/researchers from almost all major semiconductor companies, tool vendors, and leading universities. As always, the focus of the User Group Series is to promote audience participation, interaction among the attendees, offer networking opportunities, and provide a lastingway to communicate critical issues, even after the workshop. We hope that this year was well received, and we look forward to hearing your thoughts on how to keep improving over the years to come. ISTFA 2022 USER GROUP HIGHLIGHTS Keith Serrels* and Daminda Dahanayaka,** ISTFA 2022 User Group Chair/Co-Chair *NXP Semiconductors, Austin, Texas — keith.serrels@nxp.com **GlobalFoundries, Malta, N.Y. — daminda.dahanayaka@globalfoundries.com ISTFA 2022 OPTICAL FAULT ISOLATION, TEST, AND DIAGNOSIS USER GROUP Chair/Co-Chairs: Dan Bockelman, Neel Leslie, and Kevin Distelhurst dan.bockelman@intel.com, neel.leslie@thermofisher.com, kevin.distelhurst@globalfoundries.com The Optical Fault Isolation, Test, and Diagnosis User Group conducted its annual meeting at ISTFA 2022. New this year, the session realigned its focus on contactless probing and its upcoming challengeswithnew transistor technology on the horizon. This change resulted in the nanoprobing portion spinning out into its own user group. The new format enabled a smaller session, with approximately 100 participants joining in person, with more in depth and thought provocative discussions. To stimulate the discussion three seeded presentationswere invited. The topics of thepresentations included: quantum diamondmicroscopy, differential laser voltage probe, and x-ray device alteration. The first presentation, “EFA Demonstration on Quantum Diamond Microscope” by Pauli Kehayias from Sandia National Labs introduced the capability of the quantumdiamondmicroscope. Kehayias presenteda case studywhere themicroscopewas able to determine shorts inaquantumcomputingdevice. Thediscussion continued with questions around the application’s ability to handle different packaging types, specifically wire bonded or sampleswithpockets. Further discussion revolved around the spatial resolution of such techniques and the viability of the technique for backside power rail. Kehayias informed the group that the diffraction limit would be around ~100 nm and invited others in the FA community to help develop. The next presentation was “Differential Laser Voltage Probe: A New Approach to a Fundamental Technique” by Kristofer Dickson, NXP Semiconductors. The presentation included a brief introduction to the new technology, which biases the device under test at 50% pass/fail and collects simultaneous LVPwaveforms, inwhich the failing waveform is subtracted from the passing waveform. This
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