edfas.org ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 25 NO . 1 34 ISTFA 2022 PANEL & USER GROUPS The Panel Discussion is a unique format for ISTFA participants to share the challenges FA engineers are facing, suggest tips and ideas, and propose possible practical solutions in an interactive and engaging manner. The discussion topics traditionally alignwith the theme of ISTFA, and it was no different this year. The ISTFA 2022 Panel Discussion focused on whether our future FA is isolating elusive and intriguing defects. The session was opened by polling attendees on what they thought was the biggest challenge the FA community faces. Five options were presented: heterogeneous packaging/integration, revolution in 3D integration, resolution limitation in fault isolation techniques, lack of tools and skillsets, anddesign for test andFA. Amajority of attendees felt that resolution limitation of fault isolation techniques was the biggest roadblock in our ability to isolate elusive defects in advanced technology node and packaging. A teamof four esteemed panelists shared their diverse technical and management experiences. Zhiyong Wang is the managing director of the Global Failure Analysis Engineering group of Analog Devices. He has 22 years of FA experience in digital, analog, andmixed signal devices used in a variety of industries such as automotive, aerospace, industrial, healthcare, data center and cloud, and mobile and consumer electronics. Susan Li is the director of Failure Analysis Engineering at InfineonTechnologies. She has 25 years of experience in failure analysis with expertise in improving FA lab operations and process flows, as well as developing advanced FA tools/techniques to support a range of products from memory, MCU, to wireless IoT products. Venkat Ravikumar is the principalmember of Technical Staff at AMDSingapore. With 15 years of experience in fault isolation and failure analysis at AMD, he is an expert in tester-based fault isolation such as photon emission, soft defect localization, and laser probing. Michael Khazhinsky is the principal ESD engineer/ designer at Silicon Labs. With more than 25 years of experience in the ESD field, he is also the director of the ESD Association. He has served as a member of various conferences such as IRPS, IEW, ESREF, and EMC, as well as EOS/ESD Symposium technical program committee and general chair. Each panelist briefly presented their unique perspectives. Wang’s presentation emphasized the importance of teamwork and effort, elements which are quintessential A SUMMARY OF THE ISTFA 2022 PANEL DISCUSSION: IS OUR FUTURE FA IDENTIFYING/ISOLATING ELUSIVE AND INTRIGUING DEFECTS? Erwin Hendarto,* Anita Madan,** and Steven Herschbein*** ISTFA 2022 Panel Discussion Organizers *Silicon Labs, Austin, Texas — erwin.hendarto@silabs.com **Independent Consultant, New York, N.Y. — amadan16@gmail.com ***Independent Consultant, East Fishkill, N.Y. — steven.herschbein@gmail.com The 2022 panel featured four experts (center) with diverse backgrounds.
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