edfas.org ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 25 NO . 1 32 ISTFA EXPO Chasing ever-smaller andmore elusive defects cannot be donewithout advanced tools. Thus, the Expo is always a popular event at the ISTFA conference. This year, 64 ven- dors showcased their latest tools, techniques, and solutions in the FA fields, such as test, diagnosis, fault isolation, sample preparation, imaging, and characterization. The Expo brought tool and technique suppliers and users together with benefits to both. The vendors got feedback from users on the tools, techniques, and solutions for further improvement, while users visiteddifferent vendors at one time to see the latest developments. Thanks to Becki Watt and Rose Ring for their efforts. WEFA EVENT The Women in Electronic Failure Analysis (WEFA) networking session has become a regular event since its inception in 2018. This year, theWEFA networking session was kicked off by Sandy Robert, Executive Director of ASM International with a speech on “supporting the journeys of women in STEM.” The sessionwas well attended. About 50 people including many men attended the event. Everyone had a chance to introduce themselves andmeet others to build connection. ISTFA ismore than just a technical conference. It is also a community gathering. The success of ISTFA greatly relies on the hardwork of many volunteers and the outstanding support from ASM International. I would like to sincerely thank all the volunteers, session chairs/co-chairs, reviewers and especially the ISTFA 2022OrganizationCommittee and ASM International staff. ISTFA 2022 is over, but the spirit of the event is ongoing. ISTFA 2023 will be held from November 12 to November 16, in Phoenix. The organizing committee, led by the General Chair Frank Altmann, has already started planning for the conference. Please consider volunteering and sharing your innovative work at ISTFA 2023. ISTFA 2022 ORGANIZING COMMITTEE General Chair - Zhigang Song, IBM Past General Chair - Susan Li, Infineon Vice General Chair - Frank Altmann, Fraunhofer IMWS Technical Program Chair - Yan Li, Intel Tutorial &Short Course Chairs - Renee Parente, AMD and Ted Kolasa, Northrop Grumman Panel Chairs - AnitaMadan, Independent Consultant and Erwin Hendarto, Silicon Labs Exposition Chairs - Becki Watt, Siemens and Rose Ring, Thermo Fisher Scientific User Group Chairs - Keith Serrels, NXP and Daminda Dahanayaka, GlobalFoundries Movie Chair - Rose Ring, Thermo Fisher Scientific AV Chairs - Christian Schmidt, NVIDIA and Kristofor Dickson, NXP FA Technology Roadmap Chair - Vinod Narang, AMD and Keith Serrels, NXP Local Arrangements Chair - Javeck Verdugo, JPL University Chair - Chuan Zhang, NVIDIA International Chairs - Bernice Zee, AMD and Guillaume Bascoul, CNES-FR ISTFA SPONSORS & SUPPORTERS On behalf of the Electronic Device Failure Analysis Society (EDFAS) and the organizers of ISTFA 2022, we appreciate your generous sponsorship contributionand recognizeyour continuedcommitment in making the ISTFA Conference and Exposition an outstanding event! Sponsors Allied High Tech Products, Inc. BSET EQ Quartz Siemens Tescan Thermo Fisher Scientific ULTRA TEC Zeiss Corporate Supporters SELA Semicaps Ted Pella Inc. Media Sponsor EDFA Magazine
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