edfas.org 31 ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 25 NO . 1 “CMOS Scaling: Where to Next?” Crabbé reviewed the industry progression fromplanar to FinFETs to nanosheet transistors with their respective benefits and implications for failure analysis. The audience had an opportunity to learn how the transistor architecture evolved. He focused on nanosheet transistors, which could become mainstream in future semiconductor devices, describing the benefits they bring to devices, fabrication challenges, and implications for FA. Understanding nanosheet transistors will better prepare engineers for the FA challenges posed by them. The conversation on small and elusive defects and their resulting FA challenges continued in thepanel discussion, where four distinguished experts fromdiverse fields discussed “Is our future FA identifying/isolating elusive and intriguing defects?” Thanks to Erwin Hendarto, Anita Madan, and Steven Herschbein for their hard work. The event was well organized and had fully engaged, interactive conversation between panelists and audiences. You can readmore details about the panel discussions starting on page 34. Attendee surveys in past years showed that people wanted to attend all user group sessions and did not like when two sessions overlap. In response, ISTFA 2022 had five user group sessions without overlap. The topics included sample preparation, FIB, nano/scanning probe, optical fault isolation (OFI)/test/diagnosis, and systemon packagewith a one hour duration for each session. Thanks toKeith Serrels andDamindaDahanayaka for their efforts; the user group sessions were well-received. In addition to the traditional technical events, ISTFA 2022 included two new special sessions. The first onewas standardized andAI-enhanced FAworkflows. Experts from tool vendors and FA engineers discussed the standardized tool interfaces, such as common stage, standardized samplingandcoordinate transfer for FAefficiency, solutions for AI-based FA such as standardized data format (including imagemetadata), anddata centralized capability and integrated FA workflows. Thanks to Thomas Schweinboeck and his team, the event was very successful. The second new session was the FA Roadmap. After several years of hard work, the three FA roadmap councils (Die Level Isolation and Post-isolation, Package Innovation, and FA Future) presented summary reports of their gap analyses and identified current technical challenges to the semiconductor failure analysis community. Thanks to Vinod Narang and Keith Serrels for their hard work. The FA roadmap sessionwas prepared verywell and thematerials were presented broadly and in depth. The event was well attended and sparked tool vendor’s interest. Attendees enjoyed the social event: A Night in Las Vegas. Sela USA Inc. demonstrated their services at the Tools of Trade Tour.
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