edfas.org ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 25 NO . 1 26 A great product idea is no guarantee of a successful business. As a third-party provider, there is the added challenge of OEM partner buy-in and management. It could have gone wrong in somany ways, and it nearly did more than once. Ultimately, we prevailed with a tool so elegant, that even a microbiologist like me could use it. Today, the industry-transforming Omniprobe technology lives on in theOmniProbemodel 350 and 400manipu- lators of Oxford Instruments. The semiconductor and microscopy industries owe a debt of gratitude to Tom Moore for his grit, courage, and perseverance to stickwith the in situ lift-out dream, despite great personal financial risk in unprecedented and challenging historical times. I am sure other lift-out inventors have equally fascinating stories to share, and I hope we get to hear them. ACKNOWLEDGMENTS This article is dedicated to two groups of people. First and foremost, I recognize and thank my Omniprobe cofounders Tom Moore and Rocky Kruger, as well as the talented individuals that worked at Omniprobe from logistics to engineering to sales and service. I include Omniprobe’s contractors, distributors, andco-opstudents. Theywere able to design, build, and deliver products with exceptional performance, customer support, and service, even across the major economic downturns of 2001 and 2009. Secondly, I want to recognizemy industry peers and competitors who also did their part to drive the industry forward. I have beenblessed toworkwith andwalk among the industry’s best talent, withmany interactions enabled by EDFAS and ISTFA. We work in a demanding business, and anyone who has been successful with execution of FIB lift-out solutions and services has my recognition and respect. Lastly, I’d like to thank Monica Vargas for being Omniprobe’s first customer and agreeing to share her name for this article. REFERENCES 1. T. 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