February_EDFA_Digital

edfas.org 9 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 23 NO. 1 CONCLUSION Efficient harvesting of evidence greatly reduces the overall time to achieve reliable root cause determination. The case studies presented show that the success rate of preserving the material that causes failure mechanisms can be greatly improved bymoving away fromaggressive methods todecapsulate samples and replacing themwith more selective and environmentally-friendly decapsula- tion technologies, such as atmospheric pressure MIP. The technology also provides a unique capability in complex advanced packaging decapsulation, ensuring a high success rate of the related failure analyses. REFERENCES 1. J. Tang, M.R. Curiel, S.L. Furcone, E.G. J. Reinders, C.T. Revenberg, and C.I.M. Beenakker: “Failure Analysis of Complex 3D Stacked- die IC Packages using Microwave Induced Plasma Afterglow Decapsulation,” IEEE Electron. Compon. Technol. Conf., 2015. 2. C. Odegard, A. Burnett, J. Tang, and J. Wang: “Preserving Evidence for Root Cause InvestigationswithHalogen-FreeMicrowave Induced Plasma Decapsulation,” Proc. Int. Symp. Test. Fail. Anal., 2018. 3. J. Tang, B. Wang, C. Liu, J. Wang, and C.I.M. Beenakker: “Unique Failure Analysis Capabilities Enabled by the MIP Decapsulation Technique,” Proc. Int. Symp. Phys. Failure Anal. Integr. Circuits, 2017. 4. J. Tang, J. Wang, St.J. Dixon-Warren, andC.I.MBeenakker: “Halogen- freeMicrowave Induced Plasma Decapsulation of System in Package Modules,” Proc. Int. Symp. Test. Fail. Anal., 2017. 5. K. Distelhurst, J. Myers, D. Bader, P. Pichumani, J. Tang, and M. McKinnon: “Analysis of 2.5D Module after Underfill Removal with a CF4-FreeMicrowave Induced Plasma (MIP) Spot Etch Process,” to be published Proc. Int. Symp. Test. Fail. Anal., 2020. Fig. 12 Localized decapsulation of stacked die silver wire bonded SD card, overview image (left) and four close-up optical images (right). ABOUT THE AUTHORS Lea Heusinger-Jonda received her B.S. in chemical engineering fromHoward University in 2017, with a focus on nanotechnology. She then worked in the physical failure analysis laboratory for Bosch’s automotive electronics sector, and focused her master thesis on the use of plasma etching for the physical failure analysis of semiconductor devices. She joined Jiaco Instruments as a sales engineer at the end of 2019. Jiaqi Tang received a B.S. inmaterials science fromFudan University in 2007 andM.Sc. inmateri- als science from University of Pennsylvania in 2009, where he was involved in research projects related to semiconductor devices. From2009 to 2014 heworked on his Ph.D. degree at Delft Institute of Microsystems and Nanoelectronics (DIMES), Delft University of Technology. His research activities focus on developing a microwave-induced plasma (MIP) instrument for copper wire bonded semiconductor package decapsulation application. The groundbreaking research jointly developed with industrial partners on the MIP technology has been presented at ECTC, ISTFA, EPTC, ICEPT conferences. Since 2014, Tang has been President and CTO of Jiaco Instruments, the start-up company he cofounded to commercialize the MIP machine.