February_EDFA_Digital

edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 23 NO. 1 52 Accelerated Analysis............................................. 52 Allied High Tech. ..............................................26-27 ASM International.......................................... 11 / 40 Checkpoint Technologies................................20-21 TESCAN USA Inc. .........................Inside front cover Quantum Focus...................... 3 / Inside Back Cover ULTRA TEC...............................................Back cover For advertising information and rates , contact: Kelly Johanns, Business Development Manager 440.318.4702, kelly.johanns@asminternational.org Current rate card may be viewed online at asminternational.org/mediakit. INDEX OF ADVERTISERS A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS ELECTRONIC DEVICE FAILURE ANALYSIS Visit the Electronic Device Failure Analysis Society website edfas.org NOTEWORTHY NEWS 2021 IRPS CONFERENCE The IEEE International Reliability Physics Symposium’s (IRPS) annual conference will be held March 21-25, 2021. IRPS 2021 will be a virtual conference. The IRPS technical program includes technical sessions, keynotes and invited talks on emerging issues, tutorials, workshops, poster sessions, a year-in-review seminar, and equipment demonstrations. Special attention is given to the reliability of advanced CMOS scaling, new materials introduction, new processes or integration strategies, and/or fundamentally newdevice architectures. Registrants experiencing IRPSwill be better equipped to solve critical reliability problems and develop effective qualification procedures that affect their company’s bottom line. The IRPS Conference is sponsored by the IEEE Reliability Society and IEEE Electron Devices Society. For more informa- tion, visit the IRPS website at irps.org . T ed Pella, Inc. .... ......................... .........................19