February_EDFA_Digital

edfas.org 51 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 23 NO. 1 Whether networking at events or accessing information through EDFA , ISTFA proceedings, or journals, our members have the edge. Now it’s time to introduce EDFAS to others in the industrywhowould like to take advantage of these career- enhancing benefits. Help us help the industry by expanding our membership and offering others the same exceptional access to information and networking that sets EDFAS apart. To reacquaint yourself with and introduce others to the EDFAS member benefits, visit asminternational.org/web/edfas/membership. EDFAS MEMBERSHIP ExpoChairs Becki Watt of Mentor andRose Ring of Howard Hughes Research Labs helped pull this off. The extensive Tutorial Session, a mainstay of ISTFA, and the popular User Group meetings unfortunately could not be included in the workshop. We used this as an opportunity to enhance the EDFAS Community on the ASM Connect Platform. Tutorial Chairs Yan Li of Intel and Randal Mulder of Silicon Labsworkedwith ASM to arrange for six tutorial authors to record 20-minute previews or excerpts from their full tutorials. These are available now at connect.asminternational.org . User Group chairs Anita Madan of GlobalFoundries, Tejinder Gandhi of Maxim, and Ted Kolasa of Northrop Grumman migrated the User Groups to the ASM Connect platform. In January 2021, four live user groups will run: FIB, Sample Prep, Contactless Probing and Nanoprobing, and System on Package. These are available to all EDFAS members and workshop attendees and could become a model for future information-sharing events for EDFAS. Another first for EDFAS is the launch of our FA roadmap that went live and is interactive for all our members to share their needs and help the industry bridge gaps that they identify. FA Roadmap Chair Keith Serrels of NXP gave a summary of the status of the roadmapdevelopment and announced its releaseonASMConnect. Since the roadmap requires input from as many people and companies as possible, ASM Connect is a perfect place to host the dis- cussions and material. The experience of this EDFAS Virtual Workshop has opened up new avenues for the society to gather in the future; this was a great event as well as a great experi- ment from which to learn. Of course, one advantage of virtual events is the removal of the expenses of travel. Workshop attendees were from 22 different countries, and International Chairs Szuhuat Goh of GlobalFoundries and Frank Altmann of Fraunhofer IWMS helped encourage that attendance. I am grateful to the many volunteers who helped make this workshop possible—the workshop committee, the technical session chairs, reviewers, authors, speak- ers, vendors, and ASM. While the workshop was a great success, I eagerly look forward to us gathering in person at ISTFA 2021 in Phoenix! Networking sessions after the talks gave attendees a chance to continue the technical conversation or catch up socially. The virtual Expo Hall was easy to navigate, making it simple to visit booths, collect information, and talk to vendors.