February_EDFA_Digital

edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 23 NO. 1 42 INSCOPE LABS PTE. LTD. 28 Ayer Rajah Crescent, #03-01 Singapore 139959 sales@inscopelabs.com +65.6779.3735 inscopelabs.com/contact-us.htm Services Offered: Analytical and electron device failure analysis (electrical localization, material analysis, and sample preparation). Tools and Techniques: SEM/EDX and sample prepara- tions, AES/XPS and photoemission microscopy (PEM), scanning optical microscopy, FIB services, C-SAM and real-time x-ray, training courses in failure analysis and optical probing techniques training course. MICROLABS SCIENTIFIC LLC 100 Burtt Rd, Suite 125 Andover, MA 01810 978.409.2812 contact@microlabsscientific.com www.microlabsscientific.com/analytical-services ServicesOffered: Analytical services, consulting services, failure analysis services, MEMS testing, process integra- tion, yield improvement, and project management. Tools and Techniques: SEM, EDS, FIB milling, cross- section, and sample preparation, Wyko NT3300 optical profilometer, Lyncee Tec reflection digital holographic microscopy profilometer, FLIR A325sc IR camera for thermal imaging, Filmetrics F20 spectral reflectance system for non-contact measurement of film thickness and index of refraction, optical microscopy, Polytec CLV- 2534 compact laser vibrometer, andmechanical (parallel) polishing. MICROTECH LABORATORIES LLC 538 Haggard ST, STE 402 Plano, TX 75074 972.633.0007 contact@fa-mal.com www.microtechlaboratories.com Services Offered: Failure analysis, component analysis, PCBA analysis, design debug, consulting, and training. Tools andTechniques: Reverse engineering, construction analysis, decapsulation, cross-section, backside sample preparation, product teardowns, circuit extractions (GDSII layouts), construction analysis, decapsulation (die expo- sure), wet decapsulation using acid jet fuming nitric and/ or fuming sulfuric acid, die decapsulation using heat or mechanical techniques, layer-by-layer deprocessing, emission microscopy, FIB design support, design repair, probe pad deposition and circuit isolation, sample prepa- ration andmechanical probing, real time x-ray, SAM, SEM/ EDS, turnkey failure analysis, full FA service on qualifica- tion failures, yield analysis, or customer returns. NERSIC MATERIAL TESTING, ANALYTICAL CHARACTERIZATION AND CONSULTING LABORATORY Chemistry Department, University of Waterloo 200 University Avenue West Waterloo, Ontario, Canada N2L3G1 877.819.8786 sales@nersic.com nersic.com Services Offered: Analytical services, consulting and training services, corrosion, contamination, defect analy- sis, elemental maps, delamination, and depth profiling. Tools and Techniques: Atomic force microscopy, ATR- FTIRmicroscope, correlativemicroscopy, electrochemical station, energy-dispersive x-ray spectroscopy on SEM, FE-SEM and environmental SEM, FIB-SEM, NMR, Raman microscopy, scanning auger microscopy, SIMS, TEM and STEM, XPS (ESCA), and XRD (powder and thin film). PACIFIC TESTING LABORATORIES 24950 Avenue Tibbitts Valencia, CA 91355-3426 661.257.1437 ptl@pacifictesting.com www.pacifictesting.com/services/failure_analysis/ Services Offered: Electrical, chemical, mechanical, envi- ronmental, optical, sample preparation, thermal analysis, metallurgical, military and commercial qualification, and failure analysis. Tools and Techniques: SEM/EDS, DSC, TGA, TMA, DMA, real-time fluoroscopic x-ray systems, including a micro- focus system, FTIR, IC, mechanical shock, metallograph, optical microscopy, shock, solderability (meniscus), solderability (weight), solderability (edge dip, rotary dip, float), steamaging, vibration (sine, random, and sinewith random), XRF, x-ray radiographic, chromate coating on zinc and cadmium surface analysis, coating/plating/case thickness, EDS, grain size, grain structure, hardness, hydro- gen embrittlement, lead-free testing, microsection, OES, photomacrography/photomicrography, plating thickness (destructive/nondestructive), salt spray (fog) corrosion analysis, stress corrosion, and welding examination. SEMION LLC 1055 NE 25th Ave, Suite H Hillsboro, OR 97124-4901 503.332.9668 info@semionco.com www.semionco.com Services offered: FIB cross sectioning, TEMsample prepa- ration, imaging and analytical services. Tools and Techniques: TEM and SEM imaging, BSE and STEM, FIB cross-section, EDS, sample preparation (TEM/ STEM, x-ray tomography), probe milling, device edit and fabrication, Barlow CMOS 100 digital imaging system for analog TEM, Barlow in situ lift out system for FIB, Barlow STEM imaging system, BatGrid carbon TEM grid replen- ished Ga LMI sources, and custom sample holders.