February_EDFA_Digital

edfas.org 41 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 23 NO. 1 DIRECTORY OF INDEPENDENT FA PROVIDERS Rosalinda M. Ring, Howard Hughes Research Labs LLC jmj4papa@yahoo.com E lectronic companies of all types and sizes require failure analysis (FA) services. Our goal is to supply a resource of FA service providers for your reference files. The directory lists independent providers and their contact information, expertise, and types of technical services offered. ADVANCED MICROANALYTICAL 50A Northwestern Drive, Unit #4 Salem, NH, 03079 877.605.6662 advancedmicroanalytical.com ServicesOffered: Comparative testing lab, compositional analysis, destructive physical analysis (DPA), engineering support, environmental monitoring, failure analysis, fire investigative/combustion byproduct, inspection services, integrated circuit support, materials characterization, nanomaterials, nondestructive testing, particle testing, particulate micro analysis (PMA), power generation and particle emissions analysis, product development R&D, product/process validation, quality assurance, and unknown material identification. Tools and Techniques: Cross-sectional analysis, CSAM, EBSD, EDS/elemental mapping, FIB-SEM, GC/GC-MS, GD-OES, hardness/micro-hardness testing, ICP-MS & ICP- OES, micro-FTIR, micro-Raman, NMR, optical microscopy, particle size distribution, physical andmechanical testing, SEM, surface profiling, TEM, XPS, X-ray imaging/3D X-ray CT, XRD, and XRF. ALBANOVA NANOLAB Roslagstullsbacken 21, SE-10691 Stockholm, Sweden +46.707.236463 albanova-nanolab.org/ebl-sem-fib/ ServicesOffered: Nano-patterning,materials and fabrica- tion, and process integration. Tools andTechniques: Raith Voyager e-beam litho, mask/ less photolithography, Oxford PlasmaLab etchers, optical microscopy, vacuum/gas annealing, e-gun deposition systems, sputtering (various metals) systems, 8/4-target systems, metal/oxide/semi films/stacks thermal deposi- tion, AGAR SEM carbon coater, Paroteq flip-chip bonder, stylus profilometer KLA Tencor P7, EMS spin coater, AFM (Bruker/JPK), MFM, Kelvin probe, cAFM, AFM with cell biology, fluorescence, FEI Nova 200 dual beam system (SEM/FIB), Pt-deposition, 3D reconstruction with slice and view, Kleindiek micro manipulators, EDX system Oxford UltimMax/AZtec for SEM-based element analysis, real-time chemical imaging, maskless lithography system SmartPrint for g-line photo resists (min. feature size 2 µm), Karl Süss Contactmask aligner MJB3 (max 2-in. wafer size, 3-in. masks), and optical profiler. EMSL ANALYTICAL INC. 200 Route 130 North Cinnaminson, NJ 08077 800.220.3675 www.emsl. com Services Offered: Integrated circuit support, failure analysis, environmental monitoring, engineering support, DPA, engineering support, compositional analysis, fire investigation/combustion byproduct analysis, compara- tive testing, x-ray imaging/CT, materials characterization, nondestructive testing, petrography, physical/mechani- cal testing, product development/R&D, product/process validation, quality assurance, remediation/insurance confirmation, unknown materials identification, and weatherization/aging studies. Tools andTechniques: Opticalmicroscopy,micro-Raman, micro-FTIR, FIB-SEM, elemental mapping, EDS, EBSD, PSA, SEM, surface profiling, TEM, XPS, x-ray imaging/CT, XRF, GC/GC-MS, HPLC/LC-MS, ICP-MS, OES-ICP, NMR, XRD, CSAM, BET, TGA, permeability analysis, magnetic proper- ties, flashpoint testing, DSC, and DMA/Vicat. FIB-X 538 Haggard ST, Suite 409-A Plano, TX 75074 Telephone: 214.473.6764 fib@fibx.com fibx.com/contact.html ServicesOffered: Oil and gas, shale SEMmaps imaging, IC design verification, debug, cross sections, decapsulation and encapsulation, and x-services. Tools and Techniques: SEM-FIB cross-section and imaging, circuit edit, FIB-SEM shale 3D SEM imaging, defect analysis with EDS, SEM 2D mosaic large area imaging, sample preparation, and backscattered electron imaging (argon ion mill).