February_EDFA_Digital

edfas.org 19 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 23 NO. 1 ABOUT THE AUTHORS (cont'd) AdamWaite is a lead cyber scientist in Battelle’s cyber trust & analytics group, having joined the group in 2018. He leads the verification and validation imaging team, drawing upon awealth of knowl- edge in nanoscalematerials characterization, nanoscale synthesis, thin filmdeposition, and electron microscopy. He holds a Ph.D. in materials science and engineering from the University of Dayton. Glen “David” Via has beenwith the aerospace components and subsystems division of the Sensors Directorate at the Air Force Research Laboratory (AFRL/ RYDT) at Wright Patterson Air Force Base in Dayton, Ohio for over 30 years. His initial work as a process engineer focused on compound semiconductor device/circuit development. For the past two decades, he has led numerous independent test and evaluation efforts in support of DARPA technology development programs including: WBGS-RF, NEXT, MPC, NJTT, ICECool, COSMOS, DAHI, and DREaM. Currently he leads the Quantifiably Assured Manufacturing (QAM) Technical Execution Area (TEA) on the Trusted & Assured Microelectronics (T&AM) program. Via received his B.S. in electrical engineering from Wright State University in 1992whileworking at AFRL and completed his M.S. in systems engineering andmanage- ment science from the University of Dayton in 2011.