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edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 22 NO. 4 8 EBIC’s widespread implementation. Though a capacitor sample is a relatively simple example device, its prepara- tion was still challenging and time consuming, and only a miniscule volume of the source component was studied. Further development in sample fabrication techniques and technology could enable preparation ofmore compli- catedSTEMEBIC sampleswith higher throughput, making routine STEM EBIC characterization more practical. ACKNOWLEDGMENTS This work was supported by The Aerospace Corpor- ation’s iLab Sabbatical Program. REFERENCES 1. L. Reimer and H. Kohl: Transmission Electron Microscopy: Physics of Image Formation, 5th ed. New York, NY, Springer, 2008. 2. T.E. Everhart, O.C. Wells, and R.K. Matta: “A Novel Method of Semiconductor DeviceMeasurements,” Proc. IEEE, 52 (12), Dec. 1964, p. 1642–1647, doi: 10.1109/PROC.1964.3460. 3. C. A. Smith, et al.: “Resistive Contrast Imaging: A New SEM Mode for Failure Analysis,” IEEE Trans. Electron Devices, 33 (2), Feb. 1986, p. 282–285, doi: 10.1109/T-ED.1986.22479. 4. W.A. Hubbard, M. Mecklenburg, H.L. Chan, and B.C. Regan: “STEM Imaging with Beam-Induced Hole and Secondary Electron Currents,” Phys. Rev. Appl., 9 10 (4), Oct. 2018, p. 044066, doi: 10.1103/ PhysRevApplied.10.044066. 5. M. Mecklenburg, W.A. Hubbard, J.J. Lodico, and B.C. Regan: “Electron Beam-Induced Current Imaging with Two-Angstrom Resolution,” Ultramicroscopy, 207, Dec. 2019, p. 112852, doi: 10.1016/ j.ultramic.2019.112852. 6. W.A. Hubbard, et al.: “Nanofilament Formation and Regeneration during Cu/Al2O3 ResistiveMemory Switching,” Nano Lett., Apr. 2015, doi: 10.1021/acs.nanolett.5b00901. 7. M. Mecklenburg, et al.: “Fabrication of a Lift-Out Grid with Electrical Contacts for Focused Ion Beam Preparation of Lamella for In Situ Transmission Electron Microscopy,” Microsc. Microanal ., 19 (S2), Aug. 2013, p. 458–459, doi: 10.1017/S1431927613004285. 8. W.A. Hubbard, et al.: “Scanning Transmission Electron Microscope Mapping of Electronic Transport in Polycrystalline BaTiO 3 Ceramic Capacitors,” Appl. Phys. Lett., 115 (13), Sep. 2019, p. 133502, doi: 10.1063/1.5117055. 9. D. Liu: “A General Reliability Model for Ni-BaTiO 3 -Based Multilayer Ceramic Capacitors,” presented at the Capacitors and Resistors Technology Symposium, Santa Clara, CA, United States, Apr. 2014, Accessed: May 21, 2019, https://ntrs.nasa.gov/search. jsp?R=20140013410. 10. D. D. Liu, “Insulation Resistance Degradation inNi–BaTiO 3 Multilayer Ceramic Capacitors,” IEEE Trans. Compon. Packag. Manuf. Technol., 5 (1), Jan. 2015, p. 40–48, doi: 10.1109/TCPMT.2014.2374576. ABOUT THE AUTHOR William Hubbard earned a B.A. in physics and mathematics from Boston University in 2008, after which he worked as a research assistant in the Harvard University Physics Department until 2010. He received his Ph.D. in condensed matter experimental physics in 2017 from the University of California, Los Angeles, where he was a postdoctoral scholar until 2019. He has been a member of the technical staff at The Aerospace Corporation in El Segundo, Calif. since 2018 and is founder and CEO of NanoElectronic Imaging Inc. (NEI) in Los Angeles. His research focuses on nanoscale device physics and development of TEM-based techniques for detecting electronic and thermal signals in operating devices. 2020 IEDM The 66th International Electron Devices Meeting (IEDM) will be held virtually December 12-16 . IEDM is a leading forum for reporting breakthroughs in the technology, design, manu- facturing, physics, and modeling of semiconductors and other electronic devices. Topics of interest include circuit and device interactions; characterization, reliability, and yield; compound semicon- ductor and high speed devices; memory technology; modeling and simulation; nano device technology; optoelectronics, displays, and imagers; power devices, process and manufacturing technology, and sensors, MEMS, and BioMEMS. IEDM is sponsored by the IEEE Electron Devices Society. For more information, visit ieee-iedm.org and watch for any updates to the meeting plan. NOTEWORTHY NEWS

RkJQdWJsaXNoZXIy MjA4MTAy