November_EDFA_Digital

edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 22 NO. 4 46 NeoNxGen flexible graphite is suited for demanding appli- cations such as automotive electronics, battery thermal management, aerospace, military, and medical. NeoNxGen flexible graphite is designed to replacemul- tiple layers of synthetic graphite that have been laminated together into a stack. NeoNxGen provides a high level of heat spreading using a single graphite layer while the competition must rely on multiple layers of graphite to achieve the same level of heat spreading. The NeoNxGen P-150 grade (at 150 μm thickness) offers comparable performance at a 15% reduced cost versus competing multilayer solutions. NeoNxGen flex- ible graphite also delivers other advantages including easier handling and forming and greater reliability (no adhesive layers). The product portfolio includes the standard N-Series and the economical P-Series, while custom grades based on thickness andperformance are available upon request. Several other grades are under development to meet specific market needs. For more information, visit neograf.com “We have worked with the Japan Industrial Imaging Association (JIIA) standards organization and our lead customers tooptimizeour offering in conjunctionwithCXP so it fully exploits the specification’s benefits on the factory floor,” says Matthias Kaestner, vice president, Automotive Infotainment Systems business unit. “Our low-latency, low-power transmission solutions integrate an equalizer, cable driver, and clock data recovery into a single chip that enables camera and capture cardmanufacturers todeliver high-speed, high resolution video and control signaling along with power over a single coax cable.” Microchip’s EQCO125X40 family of CoaXPress devices is the first to implement the CXP 2.0 standard, starting from a new backward compatible design based on the specification, with an integrated clock data recovery (CDR) at all speed levels and a camera-side clock to support the demands of real-world environments. The devices signifi- cantly increasemachine-vision processing throughput by enabling cameras and capture cards to transmit four to eight times faster than alternative solutions. In addition, these devices enable four times the cable/link distance with much lower power and near-zero latency. The product family also increases design tolerances and flexibility by seamlessly locking on all frequencies at any speed, from CXP-1 to CXP-12, and eliminates the need for multiple channels by supporting 12.5 Gbps of bandwidthover a single cable. Broader cablingoptions en- sure systems can be installed where needed and the inte- gratedCDR improves jitter performance for the signal sent from the camera to the capture card. The on-camera low- frequency clock recovery eliminates the need to program a separate clock in the FPGA. The integrated link signal integrity testing enables the system to perform real-time checks of cable link integrity before andduringoperations. For card makers, Microchip’s new offering makes it easier and less expensive todevelopmore robust products that customers can deploy wherever they need them on the production line. The products enable pre-setup and real-time cable link quality tests to be performed, giving users more robust and comprehensive solutions to their challenges. They also have the option to scale up to 50 Gbps over multiple cables. “Microchip’s new CXP-12 family provides our latest productswith a compact and lowcomponent count single chipequalizer solutionwhichcan thereforeeasilymeet the CoaXPress return loss specification,” says Chris Beynon, CTOwith Active Silicon. “The devices also have an elegant feature to allow real-time cable margin testing to detect aging or worn cables before any bit errors would be seen in normal operation.” NeoGraf’s NeoNxGen graphite heat spreader material. COAXPRESS 2.0 DEVICES SPEED MACHINE VISION IMAGE CAPTURE Until the 12.5Gbps CoaXPress 2.0 interface standard was ratified last year, machine vision image capture solutions had replaced conveyor belts as the primary roadblock to achieving faster production-line throughput. Now Microchip Technology Inc. has taken the next step toward realizing the full potential of CoaXPress (CXP) on the factory floor with the first single-chip physical- layer interface devices to include features that streamline machine vision system design, maximize transmission speed, and simplify deployment in high-volume bottling operations, food inspection, industrial inspection, and imaging applications.