November_EDFA_Digital

edfas.org 43 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 22 NO. 4 Contact Information ASM International 800.336.5152 MemberServiceCenter@asminternational.org asminternational.org EuMIC general.chair@eumw2020.org eumweek.com/contact-us.html ICCE-Berlin icce-berlin.org/index.html#teams ICEBE 852.3500.0799 icebe@cbees.net icebe.org ICQD panel.waset.org/conference/2020/12/sydney/ICQD ICSICT +86.18939942169 shaofeng_yu@fudan.edu.cn icsict.com/index.asp IEDM 240.449.6746 iedm-info@ieee.org ieee-iedm.org ITC 202.973.8665 ieeeitc@computer.org itctestweek.org MRS 724.779.3003 mrs.org/fall2020 PPMS 952.920.7682 karlie@smta.org smta.org/mpage/panpac SISC ieeesisc.org SMTA 952.920.7682 smta@smta.org smta.org EVENT DATE LOCATION Pan Pacific Microelectronics Symposium 2/1-4 Honolulu Contact: PPMS February 2021 Check organizers' websites below for the most up-to-date information, in light of COVID-19. GUEST EDITORIAL CONTINUED FROM PAGE 2 conferences as a key solution to meet the future needs of our global community. Regardless of venue, the mission of ISTFA is critical to our community. ISTFA creates and captures a record of the critical problems and solutions developed tomeet the needs of our industry; this holds value to educate early practitioners but also steers the development of critical capabilities that help us better support our customers. The history ISTFA generates provides critical perspective to guide long-term planning for capability development to meet future needs (both for equipment to buy and for skills to hire). At ISTFA 2019, the beginnings of a formalized community-driven Failure Analysis Technology Roadmap, fostered by ASM and ISTFA Organizing Committees, was presented and user groupmeetings were used to develop community feedback prioritizing current needs for focus areas. I’ve enjoyed leveraging interest in the development of next-generation technologies by studying related tech- nology roadmaps attempting to predict future FA capabil- ity gaps. This and other FA Roadmap efforts will soon be shared to the EDFAS community through an interactive webportal fosteredby EDFAS-ISTFA andASMto encourage community feedback. Leveraging the breadth of perspec- tive afforded by our diverse community will be crucial to iterate towards accurate predictions. I’m confident that future ISTFA conferences will capture the truth of the future history, in-person, virtually, or, both. ABOUT THE AUTHOR Dr.BrendanForan isasenior scientist atTheAerospace Corporation where he conducts research to support reli- ability assessment of microelectronics for use in space. Prior to Aerospace, Foran led the transmission electron microscopy teamat SEMATECHwhere he supported early efforts for both copper/low-k integration andhigh-k/metal gate CMOS. Foran has a Ph.D. in inorganic chemistry from the University of Michigan where he studied atomic and electronic structure of low-dimensional semi-metals and he also post-doc’d inmaterials science and engineering at Michigandelivering research focusedon x-ray andelectron beam interrogation of polymer blends.