November_EDFA_Digital

edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 22 NO. 4 38 DIRECTORY OF INDEPENDENT FA PROVIDERS Rosalinda M. Ring, Howard Hughes Research Labs LLC jm4papa@yahoo.com E lectronic companies of all types and sizes require failure analysis (FA) services. Our goal is to supply a resource of FA service providers for your reference files. The directory lists independent providers and their contact information, expertise, and types of technical services offered. AAA (ACCURATE, ACCREDITED, AFFORDABLE) TEST LAB 2320 Commerce Park Dr. Palm Bay, FL 32905 321.765.6331 customerservice@aaactl.com aaactl.com/contact.cfm Services Offered: Electrical testing and component authentication. Tools and Techniques: Pin correlation, memory test, DC testing, AC testing, AC/DC testing, external visual inspec- tion, RTS, internal visual inspection, x-ray, XRF, baking, dry-pack, tape & reel, lead formation & crimping, LED color & brightness, Hi-POT, thermal cycling, and burn-in. ADVANCED COMPONENT TESTING 3279 Veterans Memorial Highway #D8 Ronkonkoma, NY 11779 631.676.6390 sales@actestlab.com actestlab.com ServicesOffered: Electrical testing, failure analysis,mate- rial analysis, authenticity inspection, and engineering and logistics services. Tools and Techniques: AC/DC characteristics, functional, parametric, Group A, B, C V-I curve trace, up screening, burn-in, life testing, physical dimension, external visual, component surface, lead condition inspection, marking permanency, blacktopping (resistance to solvents), mechanical scrape test, internal visual die (DPA), x-ray die bond/frame inspection, visual testing via SEM, ICdecapsu- lation/de-lidding, HST testing, BGA inspection, proprietary OCM database comparison, material analyses, XRF metal composition, RoHS compliance, MIL lead compliance, dye penetration inspection, quality/reliability tests, fine/gross leak testing, solderability testing, temperature cycling, coplanarity inspection, die shear testing, bondpull testing, up screening, device programming, blank verification, UV erasure, bake/dry pack, tape/reeling, engineering review and comprehensive reports. IC FAILURE ANALYSIS LABS 1719 S. Grand Ave. Santa Ana, CA 92705-4808 949.329.0340 info@ICFailureAnalysis.com icfailureanalysis.com/reliability-testing Services Offered: Failure analysis, reliability testing, and counterfeit component authenticity. Tools and Techniques: Optical microscope, x-ray (2D) examination, SAM, I-V (curve trace) measurement, level 2 (destructive), chemical and laser decapsulation, photo emissionmicroscopy (EMMI andOBIRCH), level 3 (destruc- tive), delayering, parallel lapping, SEM, AFManalysis, cross sectioning, dye andpry analysis, EDX, PCB failure analysis, FIB precision cutting, PCB cost analysis, IC, package, and PCB reverse engineering, optical profiler, SCM, SIMS, TEM, x-ray (3D) examination, autoclave or pressure cooker test, bias life test, die shear test, ESD charged device model, ESD human body model, ESD machine model, highly accelerated temperature and humidity stress test, high- temperature storage life test, high temperature operating life test, burn-in, humidity-bias test, latch-up test, lead integrity test,markpermanency test,moisture/reflowsen- sitivity classification, physical dimension measurement, preconditioning test, real time thermal profiling, solder- ability, solder ball shear test (BGA), temperature cycling air to air, temperature humidity bias lifetest 85°C/85%, wire bond pull test, and wire bond shear test. INSCOPE LABS PTE. LTD. 28 Ayer Rajah Crescent, #03-01 Singapore 139959 sales@inscopelabs.com +65.6779.3735 inscopelabs.com/contact-us.htm Services Offered : Analytical and electron device failure analysis (electrical localization, material analysis, and sample preparation). Tools and Techniques: Scanning optical microscopy: multi-laser NIR scanning optical microscope, 1064 nm laser (capable of electron-hole pair generation through backside silicon), and 1340 nm laser (high resolution thermal probe which allows localized heating). Multiple techniques available (VBA, TIVA, SDL), photon emission microscopy, high sensitivity macro lens, high sensitivity detector (cooledCCDcamera& InGaAs camera), SEM&EDS analysis, SAM, PEM/SOM, mechanical polishing, chemical decapsulation, TEM sample preparations, mechanical polishing, FIB, and sputter coating of sample (Au or Cr).