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edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 22 NO. 3 52 PRODUCT NEWS Ted Kolasa, Northrop Grumman ted.kolasa@gmail.com PRESS RELEASE SUBMISSIONS: MAGAZINES@ASMINTERNATIONAL.ORG LASER PFIB ACCELERATES ANALYSIS OF 3D AND SUB-SURFACE FEATURES Thermo Fisher Scientific announces its new Thermo ScientificHelios 5 Laser PFIB system, an advanced focused ion beam scanning electron microscope (FIB-SEM) with a fully integrated femtosecond laser that quickly charac- terizes millimeter-scale volumes of material in 3D with nanometer resolution. TheHelios 5Laser PFIBcombines theThermoScientific Elstar SEM Column for ultra-high-resolution imaging and advanced analytical capabilitieswith a plasma FIB column for top performance at all operating conditions, and a femtosecond laser that enables in-situablationatmaterial removal rates not previously obtained by a commercially available product. The Helios 5 Laser PFIB is part of the fifth generation of the industry-leading Helios family. “The Helios 5 Laser PFIB dramatically accelerates the pace of research for both industrial and academic users, allowing them to characterize materials in a matter of minutes versus the days it took before,” says Rosy Lee, vice president of materials science at Thermo Fisher. “Not only can researchers quickly and accurately image statistically relevant, site specific, millimeter-sized cross-sections at nanoscale resolution, they can also set up large volume 3D analyses to be automatically completed overnight, freeing up the microscope for other uses.” The Helios 5 Laser PFIB lets users obtain accurate large-volume 3D and sub-surface data up to 15,000 times faster than a typical gallium ion source focused ion beam (Ga-FIB). For many materials, a large cross-section of hundreds of microns can be milled by the Helios 5 Laser PFIB in less than five minutes. Serial-section tomography is nowpossiblewith this combination of laser and plasma FIB, and when combined with EDS and EBSD detectors, can be extended to 3D elemental and grain orientation analysis at the millimeter scale. TheHelios 5 Laser PFIBmakes it easy for industrial and academic labs to process challenging non-conductive, air-sensitive, and beam-sensitive materials. They can also expedite failure analysis while obtaining fast access to buried subsurface layers often inaccessible with tradi- tional FIB. The FIB-SEM can be used to analyze a variety of materials including semiconductors, metals, batteries, glass, ceramics, paint coatings, polymers, biomaterials, and graphite. For more information, visit thermofisher.com. 3D IMAGE SENSING PLATFORM FOR SMART VIDEO SOLUTIONS Ambarella, Inc., an AI vision silicon company, Lumentum, a leading designer and manufacturer of optical and photonic products, and ON Semiconductor, a leading provider of CMOS image sensor solutions, announced a joint 3D sensing platform for the develop- ment of intelligent control systems and smart video prod- ucts. The platform is based on Ambarella’s CV25 CVflowAI vision system on chip (SoC), structured light powered by Lumentum’s VCSEL technology, andON Semiconductor’s AR0237IR image sensor. Traditional structured light solutions need to use both an infrared (IR) camera and a separate RGB camera and typically, a dedicated ASIC for depth processing. This new platform leverages a single ON Semiconductor AR0237 RGB-IR CMOS image sensor to obtain both a visible image for viewing and an infrared image for depth sensing. The Ambarella CV25 AI vision SoC powers depth The Thermo Scientific Helios 5 Laser PFIB system.