August_EDFA_Digital

edfas.org 45 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 22 NO. 3 DIRECTORY OF INDEPENDENT FA PROVIDERS Rose M. Ring, Howard Hughes Research Lab LLC jm4papa@yahoo.com E lectronic companies of all types and sizes require failure analysis (FA) services. Our goal is to supply a resource of FA service providers for your reference files. The directory lists independent providers and their contact information, expertise, and types of technical services offered. AAA (ACCURATE, ACCREDITED, AFFORDABLE) TEST LAB 2320 Commerce Park Dr. Palm Bay, FL 32905 321.765.6331 customerservice@aaactl.com aaactl.com/contact.cfm Services Offered: Electrical testing and component authentication. Tools and Techniques: Pin correlation, memory test, DC testing, AC testing, AC/DC testing, external visual inspec- tion, RTS, internal visual inspection, x-ray, XRF, baking, dry-pack, tape & reel, lead formation & crimping, LED color & brightness, Hi-POT, thermal cycling, and burn-in. ADVANCED CIRCUIT ENGINEERS 308 S. Abbott Ave. Milpitas, CA 95035 408.719.1617 sales@advancedcircuitengineers.com advancedcircuitengineers.com Services Offered: Advanced failure analysis and micros- copy analytical services. Tools and Techniques: TEM-STEM imaging, EELS-EDX, SEM, EBSD, dual-beam FIB cross section, TEM lamella sample preparation and FIB circuit edit services down to 7 nm. ADVANCED COMPONENT TESTING 3279 Veterans Memorial Highway #D8 Ronkonkoma, NY 11779 631.676.6390 sales@actestlab.com actestlab.com ServicesOffered: Electrical testing, failure analysis,mate- rial analysis, authenticity inspection, and engineering and logistics services. Tools and Techniques: Material (XRF) analysis, RoHS compliance, military lead compliance, dye penetrant inspection, DPA, fine/gross leak testing, solderability testing, bondpull testing, temperature cycling, device pro- gramming/blank verification, die shear testing, coplanar- ity inspection, bake/dry pack, lead condition inspection, device composition via XRF, physical dimension inspec- tion, RoHS compliance/MIL lead compliance, marking, permanency inspection, x-ray inspection, blacktopping inspection, visual testing via SEM, resistance to solvents, BGA inspection, heated solvent testing, electrical curve tracing, mechanical scrape test, and die verification via OCM die database. COVALENT METROLOGY 921 Thompson Place Sunnyvale, CA 94085 408.372.8900 hello@covalentmetrology.com covalentmetrology.com Services Offered: Failure analysis, material character- ization, measurement, imaging, and thermomechanical analysis services. Tools and Techniques: PCBA testing and analysis, dye & pry testing, cross sectioning, XRD, XRR, spectral ellipsom- etry, UV-VIS-NIR, optical profilometry, white light inter- ferometry, patterned light/wide-area 3D measurement, laser confocal microscopy, advanced optical microscopy, nanomechanical testing, AFM/SPM, SEM, FIB-SEM, plasma FIB-SEM, SEM-EDS, TEM, x-ray CT, XPS, TOF-SIMS, EPMA, WDXRF, Auger, TGA, DSC, FTIR, ATR FTIR, NMR, ICPMS/ ICP-OES, tensile testing, Hall voltage, and particle count- ing (SP1, SP3). EBATCO 10025 Valley View Rd., Suite 150 Eden Prairie, MN 55344 952.941.2199 info@ebatco.com ebatco.com ServicesOffered: Material characterization, failure analy- sis, and technical consulting. Tools andTechniques: DSC, EDS, SEM, STA, contact angle, dynamic contact angle, interfacial tension, micro contact angle, powder contact angle, surface free energy, density, refractive index, surface/interfacial tension, viscos- ity, microindentation, microscratch, modulus mapping, nanoDMA, nanoindentation, nanoscratch, EDS, failure analysis, metallography, microhardness, nanohardness, sample preparation, SEM, SPM, DMA, DSC, specific heat, STA, TGA, TMA, Coulter principle, dynamic light scatter- ing, laser diffraction, friction, wear, particle, pore size, and solid surface.