August_EDFA_Digital

edfas.org 37 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 22 NO. 3 Analysis (WEFA) will hold another panel/meeting this year. The ISTFA Expo is a must-see for all failure analysts. Nowhere else is assembled such a collection of vendors, tools, and techniques specific to failure analysis. With more than 80 vendors, the Expo is the perfect place to learn about new technologies, capabilities, and tools to make your job easier and more productive. The Expo floor is also a fun place to reconnect with colleagues while checking out the booths. The Tools of the Trade tour on Monday, which highlights new offerings, continues to grow in popularity, so sign up early to reserve your space. The FATechnologyRoadmapcommittee, chairedbyDr. Keith Serrels of NXP Semiconductors, began its work last year, and theywill share their progress ina special talk. The roadmap is arranged into three sections: 1) an assessment of the current state-of-practice for advanced FA tools and TECHNICAL SESSIONS Symposium sessions will be packed with high quality, innovative, and original unpublished pre- sentations in two tracks: • Emerging FA Techniques • Fault Isolation • Microscopy • Packaging & Assembly • Product Yield, Test, and Diagnostics • 3D Device Failure Analysis • Case Studies: Device Analysis • Case Studies: FA Processes • FIB Sample Preparation • Sample Preparation and Device Deprocessing • Hardware Attacks, Security, and Reverse Engineering • Nanoprobing and Electrical Characterization • Scanning Probe Analysis • FIB Circuit Analysis and Edit • Board and System Level FA • Space Application FA • Detecting and Preventing Counterfeit Microelectronics • AI Application for FA (New) • MEMS FA (New) techniques, 2) an industry-driven gap analysis to iden- tify current technical challenges and potential solutions through vendor engagement, and 3) a technology forecast that will screen respected public-domain roadmaps to provide a projection of what may be coming soon. The roadmapwill bemade available to the EDFAS community via a dedicated FA Roadmap portal that will be hosted on ASMConnect, where it can become a recognized technical platformand resource for the failure analysis community. I look forward to seeing you at ISTFA this year wherewe can all expand our knowledge and networks to advance our work, careers, and professional growth. Many new safety protocols will be in place for your comfort and pro- tection. Check the ISTFA 2020 website for the most up-to- date information on howCOVID-19may impact the event. A stroll through downtown Pasadena leads to many quaint spots. The courtyard entrance of the Westin Pasadena by Marriott, the conference hotel.