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edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 22 NO. 3 24 distinguish wet and dry samples in absorption contrast mode. TOMOGRAPHY OF WATER ENVELOPE OVER GRAINS IN BENTHEIMER SANDSTONE Figure 10 shows the results of an experiment in which anotherporousmedia, asandstonesample,was immersed in water and scanned to obtain 3D tomographic slices. A clear improvement in the contrast of grain bound- aries is seen comparing the phase contrast tomographic slices of the wet sandstone sample (middle image) over its corresponding absorption contrast virtual section (left image). In the scattereddark field tomogram(right image), the water envelope over the grains are highlighted. CONCLUSION This article demonstrated the power and potential of Fig. 9 Radiograph of porous ceramic material showing three-contrast imaging. Left image (absorption), middle image (phase contrast), and right image (dark field). There is no difference between dry and wet samples under absorption contrast, while under phase contrast, the wet sample (lower middle image) showed the phase fringe of the water meniscus. In the dark field images, there is contrast difference between the wet and dry samples because of the change in the x-ray scattering response between them. Fig. 10 Bentheimer sandstone soaked in water for 3D tomography. Representative tomographic slices are shown left to right, for absorption, phase contrast, and dark field data set. themodifiedTalbot basedx-ray interferometer systemthat has the power to solve several PFA failure mechanisms in next generation advanced packages and can also be used in many other industrial materials research applications. The system provides three contrast mechanisms simul- taneously, absorption, phase, and dark field/scattering contrast. It is envisioned that the x-raymicroscopy system will have great utility in solving some of themost challeng- ing imaging problems not only in advancedpackaging and electronic devices, but also in a variety of industries from polymers and soft materials to battery research. REFERENCES 1. S.H. Lau, et al.: “Non-Destructive Failure Analysis Technique with a Laboratory Based 3D X-ray Nanotomography System,” LSI Testing Symposium, Japan 2006. 2. C.Y. Liu, et al.: “High Resolution 3D X-ray Microscopy for Streamlined Failure Analysis Workflow,” IEEE IPFA Conference Proceedings, 2016.