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edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 22 NO. 3 2 PURPOSE: To provide a technical condensation of information of interest to electronic device failure analysis technicians, engineers, and managers. Nicholas Antoniou Editor/Nova Measuring Instruments nicholas-a@novameasuring.com Scott D. Henry Publisher Mary Anne Fleming Manager, Technical Journals Kelly Sukol Production Supervisor Joanne Miller Managing Editor Victoria Burt Contributing Editor ASSOCIATE EDITORS Navid Asadi University of Florida Guillaume Bascoul CNES France Felix Beaudoin GlobalFoundries Michael R. Bruce Consultant David L. Burgess Accelerated Analysis Jiann Min Chin Advanced Micro Devices Singapore Edward I. Cole, Jr. Sandia National Labs Szu Huat Goh GlobalFoundries Singapore Ted Kolasa Northrop Grumman Innovation Systems Rose M. Ring Howard Hughes Research Lab LLC David Su Yi-Xiang Investment Co. Sam Subramanian NXP Semiconductors Paiboon Tangyunyong Sandia National Labs Martin Versen University of Applied Sciences Rosenheim, Germany FOUNDING EDITORS Edward I. Cole, Jr. Sandia National Labs Lawrence C. Wagner LWSN Consulting Inc. GRAPHIC DESIGN Jan Nejedlik, designbyj.com PRESS RELEASE SUBMISSIONS magazines@asminternational.org Electronic Device Failure Analysis™ (ISSN 1537-0755) is pub- lished quarterly by ASM International ® , 9639 Kinsman Road, Materials Park, OH 44073; tel: 800.336.5152; website: edfas. org.Copyright©2020byASMInternational.Receive Electronic Device Failure Analysis as part of your EDFAS membership. Non-member subscription rate is $150 U.S. per year. Authorizationtophotocopy itemsfor internalorpersonaluse, orthe internalorpersonaluseofspecificclients, isgrantedby ASM Internationalfor librariesandotherusersregisteredwith theCopyrightClearanceCenter(CCC)TransactionalReporting Service, provided that the base fee of $19 per article is paid directlytoCCC,222RosewoodDrive,Danvers,MA01923,USA. Electronic Device Failure Analysis is indexed or abstracted by Compendex, EBSCO, Gale, and ProQuest. S ensorization has revolutionized the way people interact with each other and the world. “I don’t know” is no longer acceptable–we expect our sensors to tell us everything. • Did I take enough steps today to stay healthy? My pedometer sensors need to tell me. • Are the machines in my factory going to need repair soon? My industrial monitoring sensors must notify the equipment engineer. • Is a child about to run in front of my car? The motion detector sensors should not only tell me, but also tell the car itself to apply the brakes immediately. This continuing demand for products to be “smart” requires an unprec- edented level of sensing. Devices, cars, and homes must now listen to our commands and questions and provide the desired actions and information. Smartphones nowhave over a dozen sensors, while cars have hundreds; they monitor our fitness, tell uswherewe are andwherewe’re going, and even save our lives by deploying airbags during a car crash. This sensor revolution has changed the product and semiconductor landscape, creating a $60B market in 2020 predicted to grow to $90B by 2024 (Yole Développement). As the fundamental technology enabling sensor evolution, microelec- tromechanical systems (MEMS) form a critical and rapidly growing segment of the semiconductor ecosystem. MEMS sensors are micron-scale mechani- cal structures that can physically flex and move under an applied stimulus, such as acceleration, air pressure, magnetic field, and others. The motion of the mechanical element is determined using an electrical measurement, such as a capacitance change when the structure moves closer to, or further from, a stationary electrode. With the stimulus now converted to an electric signal, the attached circuits can process the information and collect data on the user’s motion, voice, temperature, heart rate, and more. To the left is an SEM image of a MEMS accelerometer. The struc- tureon the right is amass whichisfreetomoveback and forth under applied accelerations and decel- erations. Extending off the left side of this mass AUGUST 2020 | VOLUME 22 | ISSUE 3 A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS ELECTRONIC DEVICE FAILURE ANALYSIS GUEST EDITORIAL SENSORIZATION: HOWMEMS TECHNOLOGY IS ENABLING OUR DIGITAL WORLD Timothy Brosnihan, SEMI tbrosnihan@SEMI.org edfas.org (continued on page 7) Brosnihan SEM image of MEMS accelerometer.