August_EDFA_Digital

edfas.org 1 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 22 NO. 3 DEPARTMENTS Failure Analysis, Statistical Risk Assessment, and Advanced Modeling in a Structured Problem Solving Approach Corinne Bergès This article deals with a risk assessment, starting after a failure analysis and integrated in a real structured problem solving approach. ABOUT THE COVER Ultra-high resolution 3D x-ray tomographic image of a modern TSV/die stacked DRAM package. The image was acquiredat700nmvoxel. PhotobyJuanM.AtkinsonMora,Carl ZeissSBE,FirstPlaceWinnerinFalseColorImages,2019EDFAS Photo Contest. Author Guidelines Author guidelines and a sample article are available at edfas.org . Potential authors should consult the guidelines for useful information prior to manuscript preparation. 4 8 A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS AUGUST 2020 | VOLUME 22 | ISSUE 3 edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS 2 GUEST EDITORIAL Timothy Brosnihan 36 SPECIAL ISTFA PREVIEW David Gro sjean 38 ISTFA EXHIBITORS LIST 40 2020 PHOTO CONTEST 41 2020 VIDEO CONTEST 42 BOARD CANDIDATE PROFILES Zh iyong Wang 45 DIRECTORY OF FA PROVIDERS R ose Ring 48 TRAINING CALENDAR Rose Ring 50 LITERATURE REVIEW Mike Bruce 52 PRODUCT NEWS Ted Kolasa 54 GUEST COLUMNIST Nicholas Anto niou 56 ADVERTISERS INDEX Defect Characterization of Advanced Packages using Novel Phase and Dark Field X-Ray Imaging S.H. Lau, Sheraz Gul, Guibin Zan, David Vine, Sylvia Lewis, and Wenbing Yun A modified Talbot based x-ray interferometer system has the power to solve several PFA failure mechanisms in next generation advanced packages. 18 For the digital edition, log in to edfas.org , click on the “News/Magazines” tab, and select “EDFA Magazine.” SRAM Physical Failure Analysis Challenges in Technology Nodes Beyond 14 nm Noor Jehan Saujauddin, Kevin Davidson, and Esther P.Y. Chen The three case studies examined in this articledemonstrate how the classicmemory failure analysismethodologies of progressive FIBcross sectioningand top-downanalysis can be supplementedusingadvanced techniques of nanoprob- ing and TEM tomography. 8 4 Improved Signal Detection Sensitivity for High Resolution Imaging in Scanning Acoustic Tomography Hiroki Mitsuta, Taiichi Takezaki, Kaoru Sakai, Kenta Sumikawa, Masakatsu Murai, and Kotaro Kikukawa Lighter, thinner, and smaller consumer products have increasingly complex and scaled-down structures and package formats that require improved spatial resolu- tion in SAT to detect smaller defects at each bonding interface. 28 18 28