August_EDFA_Digital

SRAM PHYSICAL FAILURE ANALYSIS CHALLENGES IN TECHNOLOGY NODES BEYOND 14 nm DEFECT CHARACTERIZATION OF ADVANCED PACKAGES USING NOVEL PHASE AND DARK FIELD X-RAY IMAGING IMPROVED SIGNAL DETECTION SENSITIVITY FOR HIGH RESOLUTION IMAGING IN SCANNING ACOUSTIC TOMOGRAPHY FAILURE ANALYSIS, STATISTICAL RISK ASSESSMENT, AND ADVANCED MODELING IN A STRUCTURED PROBLEM SOLVING APPROACH 4 18 8 28 A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS AUGUST 2020 | VOLUME 22 | ISSUE 3 ELECTRONIC DEVICE FAILURE ANALYSIS edfas.org IN THIS ISSUE...