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edfas.org 47 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 22 NO. 2 • T. Krachenfels, H. Lohrke, J-P Seifert, et al.: “Evaluation of Low-Cost Thermal Laser Stimulation for Data Extraction and Key Readout,” J. Hardw. Syst. Secu., 2019, https://link.springer.com/ article/10.1007/s41635-019-00083-9. • H. Li, W. Luo, G. Li, et al.: “A Practical Wide-Field Raman Imaging Method with High Spectral and Spatial Resolution,” Rev. Sci. Instrum., 2018, 89, p 083103. • J. Li, F. Xue, F. Qu, Y-P Ho, et al.: “On-the-Fly Estimation of a Microscopy Point Spread Function,” Opt. Express, 2018, 26, p 26120. • J.N. Mait, G.W. Euliss, and R.A. Athale: “Computational Imaging [A Comprehensive Review of Image Processing],” Adv. Opt. Photonics, 2018, 10, p 409. • M. Nazari and M.W. Holtz: “[Review:] Near- Ultraviolet Raman and Micro-Raman Analysis of Electronic Materials,” Appl. Phys. Rev., 2018, 5, p 041303. • C.J.R. Sheppard, “Multiphoton Microscopy: A Personal Historical Review, with Some Future Predictions,” J. Biomed. Opt., 2020, 25, p 014511. • A. Small, “Spherical Aberration, Coma, and the Abbe Sine Condition for Physicists Who Don’t Design Lenses,” Am. J. Phys., 2018, 86, p 487. • P. Song, A. Melnikov, Q. Sun, et al.: “Contactless Non-Destructive [Optical] Imaging of Doping Density and Electrical Resistivity of Semiconductor Si Wafers using Lock-in Carrierography,” Semicond. Sci. Technol., 2018, 33, p 12LT01. • R. Tenne, U. Rossman, B. Rephael, et al.: “Super- Resolution Enhancement by Quantum Image Scanning Microscopy,” Nat. Photon., 2019, 13, p 116; see also A. Forbes and V. Rodriguez-Fajardo: “Super- Resolution with Quantum Light,” Nat. Photon., 2019, 13, p 76. • T. W. Teo, Z. Mahdavipour, and M. Z. Abdullah: “Design of an Imaging System for Characterizing Microcracks in Crystalline Silicon Solar Cells using Light Transflection,” IEEE J. Photovolt ., 2019, 9, p 1097. • C-Y Tsai: “Absorption Coefficients of Silicon: A Theoretical Treatment,” J. App. Phys., 2018, 123, p 183103. • M. Unternährer, B. Bessire, L. Gasparini, et al.: “Super-Resolution Quantum Imaging at the Heisenberg Limit,” Optica, 2018, 5, p 1150. • X. Wang and J. Liu: “[Review:] Emerging Technologies in Si Active Photonics,” J. Semicond., 2018, 39, p 061001. • X. Yan, J. Cheng, D. Bian, et al.: “Surface Profile [and Thickness] Measurement of Doped Silicon using Near-Infrared Low-Coherence Light,” Appl. Opt ., 2019, 58, p 7436. • S. Zhou and L. Jiang: “Modern Description of Rayleigh’s Criterion [For Multiple Points using Incoherent Light Which Achieves Super-Resolution Sub-Diffraction Limited Imaging],” Phys. Rev. A, 2019, 99, p 013808. Matching job seekers to employers just got easier with ASM International’s new CareerHub. After logging on to the ASM website, job seekers can upload a resume and do searches on hiring companies for free. Advanced searching allows filtering based on various aspects of electronics, e.g., R&D, manufacturing, or materials. Employers and suppliers can easily post jobs and set up pre-screen criteria to gain access to highly qualified, professional job seekers around the globe. For more information, visit careercenter.asminternational.org. VISIT THE CAREER HUB