May_EDFA_Digital

edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 22 NO. 2 38 and the International Symposium for Testing and Failure Analysis (ISTFA 2018), the authors of outstanding papers were invited to present their work during the opening session: • ISTFA 2018 Best Paper: “Power Device Burned Completely – And Now, How to Find the Root Cause?” by Peter Jacob (EMPA Material Science & Technology, Switzerland) • IPFA 2019 Best Paper: “Understanding Lifetime Prediction Methodology for In0.53Ga0.47As nFETs under Positive Bias Temperature Instability (PBTI) Condition” by Zhigang Ji, Xiong Zhang and Jianfu Zhang (Liverpool John Moores University, UK) • IRPS 2019 Best Paper: “Spatio-Temporal Defect Generation Process in Irradiated HfO 2 MOS Stacks: Correlated versus Uncorrelated Mechanisms” by Felix Palumbo (UIDI-CONICET, Argentina) On the occasion of the 30th anniversary, the opening session ended with a presentation of awards to the con- ference’s founding members (Yves Danto, Fausto Fantini, Wolfgang H. Gerling, and André Touboul) following a comprehensive summary of the life history of the sympo- sium by Nathalie Labat. Workshop sessions gave attendees multiple oppor- tunities to hear about the vision and roadmap of several key industries handling high TRL products, challenged by research laboratories and academics proposing low TRL innovative technologies. • The ECPE annual workshop on Power Devices was organized by Andreia Rojko (Mitsubishi R&D centre) and Michel Piton (Alstom). This year’s workshop focused on “Humidity and Condensation in Power Electronics Systems.” • A workshop on “Advanced Reliability Engineering Methodologies for Upcoming Challenges in Automotive” was organized by Ulrich Abelein (Infineon) and Matteo Medda (STMicroelectronics). • A workshop on Packaging “Reliability of Advanced Packaging Concepts – Challenges of FO-WLP and PLP Panel Level Packaging” was organized by Olaf Wittler (Fraunhofer IZM) and Rene Rongen (NXP Semiconductors). • A Wide Band Gap workshop with the following topic “Applications and Reliability Aspects of Commercially Available WBG Power Devices” was organized by Alain Bensoussan (IRT Saint Exupery) and Thomas Detzel (Infineon). • A DSM workshop dedicated to “New Disruptive DSM Technologies for Aeronautics and Space Applications: Role, Attributes, Challenges, Pitfalls, and Interaction with Quality and Reliability Goals” was organized by Alain Bensoussan and Fabio Coccetti (IRT Saint Exupery) The exhibition featured 21 companies and opened on Monday evening with a cocktail reception. The exhibition area hosted coffee breaks and lunches, providing the opportunity for attendees to network with key vendors representing the fields of reliability and failure physics, and analysis of electron devices and systems. Exhibitor flash presentations were scheduled at the beginning of each session toallowexhibitors to showcase their capabili- ties and know-how in front of a choosing panel of attend- ees. Moreover, booth tour sessions were organized during theweek and aB2Bmeeting agendawas set up in advance of the conference to facilitate faster networking during the paper session time slot, with the possibility for exhibitors to invite external people to their booth for a few hours. A cocktail get-together during Tuesday’s poster session and a gala dinner on Wednesday at the Aeroscopia museum provided additional networking opportunities Exhibition during coffee break. Poster session with cocktails.