May_EDFA_Digital

edfas.org 37 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 22 NO. 2 • Topic SS – Special Session “Space and Aeronautic systems” dedicated to gathering the specific papers submitted from this domain among the different topics (A to I). To draw new attendees and offer a compelling con- ference, organizers expanded the topical structure of the conference. Each topic was represented by invited papers, workshops, an oral session, and a poster session. The conference layout enabled each attendee to build his or her optimal schedule by topic or by specific interest without overlaps. On the first day of the symposium, four tutorials en- abled attendees to refresh and expand their knowledge on the following topics: • “The Future of Reliability Testing” by J.W. McPherson (McPherson Reliability Consulting LLC, USA) • “Reliability of Power Electronic Packaging” by Olaf Wittler and Andreas Middendorf (Fraunhofer IZM, Germany) • “Introducing Layered Dielectrics in Solid-State Microelectronic Devices” by Mario Lanza (Institute of Functional Nano & Soft Materials, Soochow University, China) • “Methodology of Soft Error Expertise Applied for the Use of Embedded Electronic Devices in Natural Radiation Environments” by Laurent Artola (ONERA, France) An additional tutorial was proposed at the end of the conference on optoelectronic topics: • “Review on Failure Mechanisms InGaN/GaN MQW LED for Public Light Applications” by Yannick Deshayes (IMS, University of Bordeaux, France Six invited speakers, who are recognized experts in their field, gave an overview of the state of the art and special focus on advanced research: • “Reliability Topics for the Qualification of Leading Edge Silicon CMOS Technologies for RF Applications” by Fernando Guarín (GlobalFoundries, USA) • “Generalized Framework for Assessing the Reliability of Photonic Integrated Circuits” by Paul Leisher (Freedom Photonics LLC, USA) • “The Ultra-Low Energy DELTA Scanning Electron Microscope as Novel High-Sensitivity Imaging and Spectroscopy Tool” by Rasmus R. Schröder (BioQuant, Heidelberg University Hospital & Centre for Advanced Materials, Heidelberg University, Germany) • “Non-Destructive Techniques For Evaluating The Reliability Of High Frequency Active Devices” by Jean-Guy Tartarin (LAAS-CNRS, Université Paul Sabatier Toulouse III, France) • “A Comprehensive Study of Corrosion Mechanisms for Cu-wire on Al Bond Pads” by René Rongen (NXP Semiconductors, The Netherlands) • “EMC & ESD From the Technology to the System (Challenge, Trends, application cases)” by Patrice Besse (NXP Semiconductors, France) The conferencewas opened by two keynote speeches; the first given by Maria Mazurek, (Airbus, France) on “Radiation Effects in Avionics Equipment,” and the second one presented by Jean-Renaud MEYER (CNES, France) on a “Remote Failure Analysis: A Practical Example with Microscope Mission.” Basedon an exchange agreement with the committees of the International Symposium on the Physical & Failure Analysis of Integrated Circuits Conference (IPFA 2019), the International Reliability Physics Symposium (IRPS 2019), Keynote speakers during the opening session. Attendees enjoy local cuisine and networking during lunch in the exhibition hall.