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edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 22 NO. 2 36 ESREF 2019 IN TOULOUSE Nicolas Nolhier, ESREF 2019 Conference Chair Guillaume Bascoul, ESREF 2019 Conference Co-Chair nicolas.nolhier@laas.fr guillaume.bascoul@cnes.fr EDFAAO (2020) 2:36-30 1537-0755/$19.00 ©ASM International ® T he 30th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2019) was held September 23-26, 2019, in oulouse, France. This “European capital of the space industry” is home to an Airbus assembly plant, and is considered a leader in France for embedded electronic systems. Toulouse, called “Ville rose” (Pink city) for its characteristic architecture based on terra cotta bricks, combines a strong living spirit with a brilliant past. The international symposium continued its focus on recent developments and future directions in quality and reliabilitymanagement of materials, devices, and circuits for micro-, nano-, and optoelectronics. The meeting pro- vided a European forum for developing all aspects of reli- ability management and innovative analysis techniques for present and future electronic applications. For the 30th edition, in addition to the core topics of the confer- ence, themajor companies in the aeronautics, space, and embedded systems industries were invited to present on specific topics such as radiation hardening, long-term reliability, high/lowtemperature challenges, obsolescence and counterfeit issues, wide bandgap power devices for the more electric aircraft, and other embedded system applications. A special session dedicated to space and aeronautic systems was proposed. To celebrate the 30th anniversary of both ESREF and the RADECS Conference (Radiation and its Effects on Components and Systems), which was held the week prior about 250 km away, RADECS attendees were given a discounted fee. The Technical Program Committee (TPC) led by Nathalie Labat, Hélène Frémont, François Marc (IMS, University of Bordeaux) and Fabrice Caignet (LAAS, University of Toulouse) gathered about 320 volunteers who selected 130 scientific papers to be presented during oral and poster sessions. Authors of accepted papers addressed their reviewer’s comments in the manuscript submitted for the ESREF 2019 special issue of Microelectronics Reliability. In addition, the Elsevier Editorial System implemented a strict review by two anonymous reviewers. Accepted papers from around the world covered the following topics: • Topic A – Quality and Reliability Assessment Techniques and Methods for Devices and Systems • Topic B – Semiconductor Failure Mechanisms and Reliability for Si technologies and Nanoelectronics • Topic C – Progress in Failure Analysis: Defect Detection and Analysis • Topic D – Reliability of Microwave Devices and Circuits • Topic E – Packaging and Assembly Reliability and Failure Analysis • Topic F – Power Devices and Electronic Systems: Reliability and Failure Analysis: Smart-power devices, IGBT, thyristors, SiC and GaN power devices, Power electronic system reliability • Topic G – Photonic Devices Reliability • Topic H – MEMS and Sensors Reliability • Topic I – Extreme Environments and Radiation: ESD-EOS, Latchup, EMC-EMI, Radiation impact on circuits and systems reliability Centre de Congrès Pierre Baudis in Toulouse.