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edfas.org 35 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 22 NO. 2 thepropagation-delayof the thermal response, is analyzed as a function of frequency. This analysis can either be performed in a sequential manner using classical LIT or by spectrally analyzing the time-domain data of the lock-in cycle. This approach allows for a precise localization of thermally active defects in all three spatial dimensions to guide subsequent high-resolution physical analyses. This article is an excerpt from Microelectronics Failure Analysis Desk Reference, which was published in 2019 by theElectronicDevice FailureAnalysis Society. It is available in the ASMDigital Library and in print. To access the article in full and the rest of the book, visit doi.org/10.31399/asm. mfadr7.9781627082471. ACKNOWLEDGMENTS This work was supported by the project ESiP, in which the Fraunhofer IMWS (former IWM) was funded by the German Bundesministerium für Bildung und Forschung (BMBF) under contract 13N10972 and the ENIAC Joint Undertaking. The authors gratefully acknowledge RTI international for providing TSV and Cu/Sn-Cumicrobump samples as well as Cu-filled TSV test structures. Many thanks to DCG Systems and Thermo Fisher Scientific for their support on LIT development. Additional work was performed in the project SAM3, where the German partners are funded by the German Bundesministerium für Bildung und Forschung (BMBF) under contract No 16ES0348. SAM3 is a joint project running in the Euro- pean EUREKA EURIPIDES and CATRENE programs. Fur- thermore we thank Micron and AUDI AG for financial support and providing samples. REFERENCES 1. K. Croes et al.: “Reliability Challenges Related to TSV Integration and 3-D Stacking,” IEEE Design & Test, 2016, 33 (3), p. 37-45. 2. I. DeWolf et al.: “3-D Technology: Failure Analysis Challenges,” EDFAAO, 2016, 4:24-29. 3. O. Breitenstein: “Lock-in Thermography – Basic Use for Evaluating Electronic Devices and Materials,” 2010, Springer, 255 pages. 4. R. Schlangen et al.: “Use of Lock-In Thermography for Non- Destructive 3D Defect Localization on System in Package and Stacked-Die Technology,” Proc. Int. Symp. Test. Fail. Anal. (ISTFA), 2011, p. 68-73. 5. C. Schmidt, F. Altmann: “Quantitative Phase Shift Analysis for 3D Defect Localization using Lock-in Thermography,” Proc. Int. Symp. Test. Fail. Anal. (ISTFA), 2011, p. 74-80. 6. F. Naumann et. al.: “Efficient Non-Destructive 3DDefect Localization by Lock-in-Thermography utilizing Multi Harmonics Analysis,” Proc. Int. Symp. Test. Fail. Anal. (ISTFA), 2014, p. 130-135. 7. S. Brand et al.: “Arbitrary Waveform Stimulation and TRTR Analysis for Advanced 3D LIT Inspection,” Proc. 4th CAM Workshop, Halle, Germany, 2019. 8. S. Brand et al.: “Advanced 3D Localization in Lock-In Thermography Based on the Analysis of the TRTR (Time-Resolved Thermal Response) Received upon Arbitrary Waveform Stimulation,” Proc. Int. Symp. Test. Fail. Anal. (ISTFA), 2019, p. 1-5. 9. S. Brand and F. Altmann: “Lock-In-Thermography, Photoemission, and Time-Resolved GHz Acoustic Microscopy Techniques for Nondestructive Defect Localization in TSV,” IEEE Transactions on Components, Packaging and Manufacturing Technology, 2018, 8 (5), p. 735-744. 10. S. Brand et al.: “Time-Resolved Lock-in Thermography for Defect Localization in 3D,” Proc. 3rd CAM Workshop, Halle, Germany, 2018. ABOUT THE AUTHORS Sebastian Brand is a senior scientist at Fraunhofer IMWS where he leads a research, develop- ment, and application team for nondestructive defect localization in the field of failure analysis and metrology inmicroelectronics. Brand holds a Ph.D. in electrical engineeringwhich he received in 2004 from the University of Magdeburg, Germany. In 2004 and 2005 he joined the University of Toronto and Ryerson University in Toronto, working in the field of cancer research with focus on ultrasound- based methods for early detection of treatment responses. Brand has 20 years of experience in the field of acoustics in life andmaterial sciences and authored or co-authoredmore than 70 publications in this and adjacent research fields. His current research extends from acoustic methods (scanning acoustic microscopy) over lock-In-thermography to magnetic micro-imaging where he and his team undertake research and development of nondestructive defect localization and characterization to address challenges arising from novel technologies like 3D-Integration. Frank Altmann is head of the electronic materials and components department at Fraunhofer Institute for Microstructure of Materials and Systems (IMWS). Hismain research field ismicrostructure diagnostics and quality assurance of semiconductor technologies for Si and GaN based electronic devices. Furthermore, his group works on new developments of advanced defect localization, site- specific preparation and physical failure analysis techniques for 3D packaging technologies. He has authored and co-authored more than 50 publications and five patents and lectures in the master’s program: Mechatronics, Industrial Engineering, and Physical Engineering, at theUniversity of Applied Sciences Merseburg.

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