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edfas.org 1 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 22 NO. 2 DEPARTMENTS A Biologically Inspired Approach to Interception Frances S. Chance Themodel presented here, inspired by dragonfly hunting, successfully implements proportional navigation using prey-image drift on themodel eye-screen as an input with knowledge of self-maneuvers tomaintainprey-image posi- tionas anerror signal for correcting its interception trajectory. ABOUT THE COVER A pinhole defect is localized in the dielectric liner of an elec- trically overstressed 5 x 50 µm through-silicon via (TSV) 3D interconnect by a selective substrate removal process and SEM inspection. The defect appears as a black dot in the dielectric liner of the centrally located TSV. Photo by Kristof J.P. Jacobs, Imec, First Place Winner in Black & White Images, 2019 EDFAS Photo Contest Author Guidelines Author guidelines and a sample article are available at edfas.org . Potential authors should consult the guidelines for useful informa- tion prior to manuscript preparation. 4 16 A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS MAY 2020 | VOLUME 22 | ISSUE 2 edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS 2 GUEST EDITORIAL William Hammond and Deepak Goyal 40 2020 PHOTO CONTEST 41 2020 VIDEO CONTEST 42 DIRECTORY OF FA PROVIDERS Rose R ing 44 TRAINING CALENDAR Rose Ring 46 LITERATURE REVIEW Mike Bruce 48 PRODUCT NEWS Ted Kolasa 51 GUEST COLUMNIST David Burgess 52 ADVERTISERS INDEX Combined SCM and Nanoprobing Study of Resistive Fails on SOI FinFET Devices Lucile C. Teague Sheridan and Don Nedeau A case-study is presented using both scanning capacitance microscopy (SCM) andnanoprobing to understand transis- tor level fails on silicon-on-insulator (SOI)-based finFET technology at the 14nm node. 22 For the digital edition, log in to edfas.org , click on the “News/Magazines” tab, and select “EDFA Magazine.” Innovative Puck Design for the Mechanical Cross-Sectioning and Subsequent Analysis of Semiconductor Packaged Samples in Failure Analysis Fauzia Khatkhatay and Pradip Sairam Pichumani A series of experiments shows that for the case of epoxy puck based mechanical cross-section analysis of flip-chip package devices, modifying the epoxy puck and reduc- ing the cross-sectional area to be polished significantly increases the material removal rate. 16 4 3D Hot-Spot Localization by Lock-In Thermography Sebastian Brand and Frank Altmann This article describes phase-shift analysis for analyzing stacked die packages as an approach to 3Ddefect localiza- tion based on lock-in thermography. 29 22 29 ESREF 2019 Wrap-Up A recap of the 30th European Symposiumon Reliability of ElectronDevices, Failure Physics and Analysis (ESREF 2019), held in September 2019, in Toulouse, France. 36