May_EDFA_Digital

INNOVATIVE PUCK DESIGN FOR SEMICONDUCTOR SAMPLES IN FA 4 A BIOLOGICALLY INSPIRED APPROACH TO INTERCEPTION 16 3D HOT-SPOT LOCALIZATION BY LOCK-IN THERMOGRAPHY COMBINED SCM AND NANOPROBING STUDY OF RESISTIVE FAILS ON SOI FINFET DEVICES 22 29 A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS MAY 2020 | VOLUME 22 | ISSUE 2 ELECTRONIC DEVICE FAILURE ANALYSIS edfas.org EDFAS PHOTO & VIDEO CONTESTS PAGES 40 & 41