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edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 21 NO. 4 62 eliminates scan speed limits; 2) the tunable x-ray energy maximizes secondary electron yield for chemical imaging; and 3) the high brightness sources optimize chemical sensitivity and throughput relative to laboratory sources. The LARIAT technology roadmap is to achieve <10 nm lateral resolution within the next two years. These large area chemical imaging systems will be paired with x-ray tomography endstations designed to accommodate IC device geometries, as opposed to the typical smaller area geometries in science experiments. Sample handling for ICs is a primary engineering specification for the tomog- raphy experimental endstation, which must be consid- ered from the onset to perform the IC deprocessing task. Experimental endstations such as the LARIAT may also evolve continuously to keep pace with technology with relatively minor additional investment. In my opinion, NIST also has a role to play in helping to define and vali- date the methods and criteria that are being explored to accomplish the measurement objectives. This couples with the need to establish a roadmap document for mea- surement methods associated with hardware security metrics for detection and validation. Mechanisms already exist to embed the dedicated beamline suite within a secure facility inside the NSLS-II within Brookhaven National Laboratory. Synchrotron toolswouldbe complementedbya suiteof lab-based tools for sample preparation and smaller scale deprocessing and laboratory spaces already exist immediately adjacent towhere newbeamlineswill be placed. This highlights the fact that NSLS-II is not yet fully populated and has both the capacity and infrastructure to add new custombeam- lines, another unique and timely opportunity. As a his- torical benchmark, the NIST beamline suite cost roughly $50 million dollars to build and requires approximately $1million annually tomaintain. Developing optimal end- stations with associated specifications for ICs represents a separate cost. The NIST synchrotron staff is an excellent resource to provide onsite technical support and guid- ance during the design, construction, and operations phase of such a facility. Considering the program expen- ditures by DARPA [6] and IARPA [7,8] to address this critical mission, this dedicated facility proposal has a strong eco- nomic basis. Technically, it would also leverage the most advanced science and infrastructure the United States has to offer, while providing a foundation to develop unmatched capabilities and methods for verification, validation, and root of trust for ICs. These tools also have the potential to benefit the commercial electronics sector for both design and failure analysis. This approach makes economic sense, leverages the highest levels of our nation’s science infrastructure, and allows for cooperative synergy among various intergovernmental agencies and international allies. REFERENCES 1. E.L. Principe, et al.: “Large Area Automated Deprocessing of Integrated Circuits: Present and Future,” Electronic Device Failure Analysis, 2019, 21 (3), p. 8-14. 2. Online: https://www.nist.gov/mml/materials-measurement- science-division/synchrotron-science-group. 3. NIST Liaison for Synchrotron ProgramDevelopment, ronald.jones@ nist.gov, 301.975.4624. 4. M. Holler, et al.: "High-Resolution Non-Destructive Three- Dimensional Imaging of Integrated Circuits,” Nature, 2017, 543, p. 402-406. 5. Online: http://www.synchres.com. 6. Online: https://www.darpa.mil/about-us/darpa-approach-to- trusted-microelectronics. 7. Online: https://www.iarpa.gov/index.php/research-programs/ cat. 8. Online: https://www.iarpa.gov/index.php/research-programs/ 182-research/current-research/raven. ABOUT THE AUTHOR Edward L. Principe obtained a Ph.D. in engineering science from The Pennsylvania State University andM.S. andB.S. degrees inmechan- ical engineering from the University of Central Florida. He is founder and president of Synchrotron Research Inc., a designer and manufacturer of imaging NEXAFS tools. Principe has authored two textbook chapters on FIB-Auger and FIB-based 3Dnanoto- mographic reconstruction and co-authored the EDFAS Best Paper in 2013 and EDFAS Outstanding Paper in 2017. He holds two patents in FIB-based 3D reconstruction and is focused on the development of computational guided microscopy. GUEST COLUMNIST
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RkJQdWJsaXNoZXIy MjA4MTAy