November_EDFA_Digital

edfas.org 51 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 21 NO. 4 Visit the Electronic Device Failure Analysis Society website edfas.org Contact Information ASM International 800.336.5152 MemberServiceCenter@asminternational.org asminternational.org Electrical Design of Advanced Packaging and Systems (EDAPS) edaps-2019@emlab.illinois.edu edaps2019.org IEEE EPTC +65.6547.5578 eptc2019.sec@atenga.sg https://eptc-ieee.net IEEE International Electron Devices Meeting (IEDM) 301.527.0900 ext. 2 info@ieee-iedm.org ieee-iedm.org International Association of Science and Technology for Development (IASTED) 403.247.6851 calgary@iasted.org iasted.org International Microelectronics Assembly and Packaging Society (IMAPS) 919.293.5000 bschieman@imaps.org imaps.org Micro Electro Mechanical Systems (IEEE MEMS 2020) 619.232.9499 info@mems20.org mems20.org SEMI 408.943.6900 semihq@semi.org semi.org SEMI Europe +49.30.3030.8077.0 semiconeuropa@semi.org semiconeuropa.org SEMI Japan +81.3.3222.5988 jcustomer@semi.org semiconjapan.org/en SEMI Korea +82.2.531.7800 semiconkorea@semi.org semiconkorea.org/en SMTA 952.920.7682 smta@smta.org smta.org EVENT DATE LOCATION SEMICON Korea 2/5-7 Seoul, South Korea Contact: SEMI Korea Pan Pacific Microelectronics Symposium 2/10-13 Waimea, Hawaii Contact: SMTA February 2020 EVENT DATE LOCATION International Conference on Micro Electro Mechanical Systems 1/18-22 Vancouver, Canada Contact: MEMS 2020 5th Advanced Technology Workshop on Advanced Packaging for Medical Microelectronics 1/28-29 San Diego Contact: IMAPS January 2020 EVENT DATE LOCATION 16th International Conference and Exhibition on Device Packaging 3/2-5 Fountain Hills, AZ Contact: IMAPS March 2020