November_EDFA_Digital

edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 21 NO. 4 46 PRODUCT NEWS Ted Kolasa, Northrop Grumman ted.kolasa@gmail.com PRESS RELEASE SUBMISSIONS: MAGAZINES@ASMINTERNATIONAL.ORG ELECTRON MICROSCOPE IMPROVES MAGNETIC MATERIALS IMAGING Under the Japan Science and Technology Agency SENTAN program, the joint development team of Prof. Naoya Shibata at the University of Tokyo and JEOL Ltd. has developed an electron microscope that incorporates newly designed magnetic objective lenses. The new microscope achieves direct, atom resolved imaging of materials with sub-angstrom spatial resolution, with a residual magnetic field less than 0.2 mT at the sample position. One critical dis- advantage of current magnetic condenser objective lens sys- tems for atomic reso- lution STEMs is that the samples must be inserted into very high magnetic fields of up to 3 T. Such high fields can severely hamper atomic res- olution imaging of many important soft/ h a r d m a g n e t i c m a t e r i a l s s u c h a s s i l i con s t e e l , b e c a u s e t h e s t r o n g f i e l d c a n g r e a t - ly alter or even destroy thematerial’smagnetic and physi- cal structure. Recently, the development of newmagnetic materials has advanced rapidly. As atomic scale structural analysis is key to the aforementioned technology, a solu- tion to this problem is overdue. The joint team has developed a new magnetic field- free objective lens system, containing two round lenses positioned in an exact mirror symmetric configuration with respect to the sample plane. This new lens system provides extremely small residual magnetic field levels at the sample position while placing the strongly excited front/back objective lenses close enough to the sample to obtain the short focal length condition that is essential for atomic resolution imaging. Consequently, the resid- ual magnetic fields induced near the sample center are much less than 0.2 mT, which is 10,000 times smaller than the field strengths resulting fromconventional mag- netic objective lenses used for atomic resolution TEM/ STEM imaging. The newly developed electron microscope can be operated in the same manner as a conventional STEM. It is expected to further promote substantial research and development in various nanotechnology fields. For more information, visit jeol.co.jp/en and u-tokyo. ac.jp/en. THERMAL CAMERAS CAPTURE HEAT DISSIPATION IN 3D INTEGRATED CIRCUITS FLIR Systems, Niceville, Fla., reports that researchers from the Microscale Thermophysics Laboratory at the University of Texas, Arlington are using FLIR A6700 series thermal cameras to characterize heat dissipation in 3D integrated circuits (ICs). The laboratory conducts research on microscale thermal transport, energy conversion systems, semi- conductor thermal management, bioheat transfer, and related topics. Heat dissipation in 3D ICs is a significant technological challenge, which has impeded the wide adoptionof this technology despite a tremendous amount of research over the past few decades. To measure the temperature of microelectronic devices, researchers at the lab have used awide variety of techniques including thermocouples. A major challenge with this technique is that a thermocouple onlymeasures temperature at a single point. For amore complete picture of the temperature field, the team employed thermal imaging cameras from FLIR. Designed for applications including electronics inspection, the FLIR A6700 Series thermal imaging camera has proven capable of capturing high-speed thermal events and fast-moving targets. The A6700 operates in the 3.0-5.0 µm waveband (1.0-5.0 µm broadband option) and produces finely detailed, 327,680 pixel images. Short exposure times allow users to freeze motion and achieve accurate temperature (continued on page 48) Newly developed magnetic objective lens system and high order aberration corrector as installed in a STEM.