November_EDFA_Digital

edfas.org 45 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 21 NO. 4 detection, chemical analysis,mechanical testing,material qualification, ion chromatography services, BGA rework service, circuit assembly rework and repair, SMT process validation, SMT process consulting, and SMT bootcamp training classes. Tools and Techniques: SEM/EDS analysis, optical micro- scopes,microsection/BGA analysis, real-time off-axis x-ray inspection, CT x-ray analysis with 3D volume reconstruc- tion, Dionex ion chromatograph HPLC, cross-sectioning/ microsectioning, tensile and shear force testing, dye and pry, solderability test, BGA x-ray inspection, ECO rework modifications, BGA reballing, rework, alloy conversion, and reclaim, and lead straightening/coplanarity. ROODMICROTEC +49 (0) 711.86709.44 jan.dekoninggans@roodmicrotec.com roodmicrotec.com/en/contact/contact-sales Services Offered: Supply chain management, test engi- neering, test operations, qualification and reliability tests, failure and technology analysis, device programming, and competence center for reliability and consultation. Tools and Techniques: Nondestructive testing, x-ray microscopy, x-ray computed tomography, scanning acoustic microscopy, visual control and whisker inspec- tion, materials analyses, metallography, measurement of ionic contamination, SEMand EDX spectroscopy, spectro- scopic and chromatographic methods, dye penetration inspection, IC modification and cross-sections with FIB, authenticity verification tests, PIND, ESD certification, leak tests, plastics testing, life-tests, burn-in and run-in, HAST and THB, environmental simulations and artificial aging bymeans of environmental tests from-70° to +300°C and 10 to 98% humidity (constant, cyclical, or shock), mechanical tests such as shock, bump, or vibration (sine wave vibration and random vibration), and ESD tests. SAGE ANALYTICAL LAB LLC 5744 Pacific Center Blvd., Suite 302 San Diego, CA 92121 858.255.8587 info@sagefalab.com sagefalab.com Services Offered: IC failure analysis, ESD and latch-up testing, electrical analysis, package integrity evaluation, IC package process development, analytical imaging, counterfeit analysis, competitor analysis, PCB reverse engineering, and IC process consultation. Tools and Techniques: HD tester, 3D x-ray inspection, delamination/CSAM analysis, curve tracer, jet etcher, dual-beamFIB/SEM, OptiFIB-IVFIB, Hitachimilling system, Omniprobeautoprobe, CADnav system, QFI thermal emis- sion microscope, optical microscope, Multiprobe MP1 nanoprobing system, parametric analyzer, time domain reflectometry, and reactive ion etcher.