November_EDFA_Digital

edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 21 NO. 4 38 IEDM 2019 The 65th International Electron Devices Meeting (IEDM) will be held December 7-11 at the Hilton San Francisco Union Square. IEDM is a leading forum for reporting breakthroughs in the technology, design, manufacturing, physics, and modeling of semiconductors and other electronic devices. Topics of interest include circuit and device interactions; characterization, reliability, and yield; compound semicon- ductor and high speed devices; memory technology; modeling and simulation; nano device technology; optoelectronics, displays, and imagers; power devices, process and manufacturing technology, and sensors, MEMS, and BioMEMS. IEDM is sponsored by the IEEE Electron Devices Society. For more information, visit ieee-iedm.org . 2020 IRPS CONFERENCE The IEEE International Reliability Physics Symposium’s (IRPS) annual conference will be held March 29 to April 2, 2020, at the Hilton DFW Lakes Executive Conference Center in Dallas. The IRPS technical program includes technical sessions, keynotes and invited talks on emerging issues, tutorials, workshops, poster sessions, a year-in-review seminar, and equipment demonstrations. Special attention is given to the reliability of advanced CMOS scaling, new materials introduction, new processes or integration strategies, and/or fun- damentally new device architectures. Attendees returning from IRPS will be better equipped to solve critical reliability problems and develop effective qualification procedures that affect their company’s bottom line. The IRPS Conference is sponsored by the IEEE Reliability Society and IEEE Electron Devices Society. The 2020 event will be held jointly with the International Electrostatic Discharge Workshop (IEW). For more information, visit the IRPS website at irps.org . 2020 FIB SEMMEETING The 12th annual FIB SEM Meeting will be held April 23-24 at the Kossiakoff Center at the Applied Physics Laboratory, in Laurel, Md. It will feature presentations, tutorials, and posters by FIB users and vendors, highlighting new applications and the latest technology. The event offers plenty of technical content as well as opportunities for informal discussions with your FIB colleagues. For more information, visit fibsem.net or email keana.scott@nist.gov . ANADEF 2020 The 17th ANADEF Workshop will be held June 8 to 12, 2020, at Belambra Business Club, Seignosse-Hossegor (Landes), France. The conference addresses new issues related to the latest technological developments in electronic component failure analysis, presented through tutorials, plenary sessions, micro-workshops, as well as participation by equipment manufacturers and suppliers. ANADEF, a French nonprofit scientific society established in 2001, meets biennially to bring together industry experts and mechanism scientists concerned with the prevention, detection, and failure analysis of electronic components and assemblies. For more information, visit anadef.org. NOTEWORTHY NEWS