November_EDFA_Digital

edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 21 NO. 4 12 4. H. Mertens, et al.: IEEE International Electron Devices Meeting (IEDM), 2016, p. 19.7.1-4. 5. IMEC Magazine, [Online: 2017]. Available:. https://www.imec- int. com/en/imec-magazine/imec-magazine-september-2017/ the-vertical-nanowire-fet-enabler-of-highly-dense-srams. 6. H. Feng, G.R. Low, P.K. Tan, Y.Z. Zhao, H.H. Yap, M.K. Dawood, Y. Zhou, A.Y. Du, C.Q. Chen, H. Tan, Y.M. Huang, D.D. Wang, J. Lam, and Z.H. Mai: “Investigation of Protection Layer Materials for Ex-situ ‘Lift-Out’ TEM Sample Preparation with FIB for 14 nm FinFET,” Proc Int. Symp. Test. Fail. Anal. (ISTFA), 2014, p. 478-482. 7. J. Mayer, L.A. Giannuzzi, T. Kamino, and J. Michael: “TEM Sample Preparation and FIB-Induced Damage,” MRS Bulletin , 2007, 32 , p. 400-407. 8. L.A. Giannuzzi and F.A. Stevie, “A Review of Focused Ion Beam Milling Techniques for TEM Specimen Preparation,” Micron , 1999, 30 , p. 197-204. 9. N.I. Kato, “Reducing Focused Ion Beam Damage to Transmission ElectronMicroscopy Samples,” Journal of ElectronMicroscopy, 2004, 53 (5), p. 451-458. ABOUT THE AUTHORS CecileBonifacio hasmore than 15 years of experience in electronmicroscopy sample preparation, imaging, and analysis. She has authored more than 50 publications, presented at various meetings, and taught at Lehigh University’s annual Microscopy School. In her early career, Bonifacio was a technician for Hitachi Global Storage Technology in San Jose, Calif., and a failure analysis technician for Micron Technology in Virginia. She earned advanced degrees in chemical engineering: M.S. at San Jose State University and Ph.D. at University of California, Davis. Bonifacio gained expertise in TEM, STEM, and in situ microscopy during her doctoral studies and later in her postdoctoral work at University of Pittsburgh. She joined E.A. Fischione Instruments Inc. as an applications scientist in 2016 and now focuses on TEM application development and support. Michael Campin has more than 15 years of experience in electronmicroscopy, materials charac- terization, and physical failure analysis of microelectronic devices. He received a B.S. in astronomy and physics from the University of Arizona and a Ph.D. in physics from New Mexico State University, with a focus onmicrostructural characterization of corrosion of thinmetal films. Much of his doctoral thesis work was conducted while working at the Physical and Chemical Science Center at Sandia National Laboratories in New Mexico. Campin also worked at SEMATECH as a senior engineer/elec- tron microscopist and at Advanced Micro Devices as a member of the technical staff in the device analysis laboratory before joining E.A. Fischione Instruments Inc. as an applications scientist in 2016. Kevin McIlwrath joined the JEOL TEM applications group in 2010 as a TEM/STEM applications scientist and has been in the industry for more than 24 years. McIlwrath has an extensive background in both materials and biological applications, has co-authored more than 20 papers, given talks at the various meetings in North and South America, and taught the TEM/STEM Tomography section of LehighUniversity’s Analytical ElectronMicroscopy course. McIlwrath supports customer training and demonstrations of JEOL’s TEM/STEM product line and has personal experience in TEM manufactur- ing. He concentrates on TEM/STEM applications development in both the materials and biological sciences, with a focus on Cs corrected applications, TEM/STEM, and analytical electron tomography. Paul Fischione has played a significant role in electron microscopy for more than 30 years. He is the CEO of E.A. Fischione Instruments Inc., a U.S.-based company that designs, manufactures, and distributes advanced microscopy devices for the global scientific community. Products include TEM and SEM sample preparation devices, imaging detectors, and TEM tomography specimen holders. Fischione has firmly grounded new product development in emerging technologies, which is under- scored by the number of the company’s U.S. and international patents granted during his leadership. Fischione was named a fellow of the Microscopy Society of America in 2017 and currently serves as treasurer of the International Federation of Societies for Microscopy. 10. R. Alvis, J. Blackwood, S.H. Lee, and M. Bray, “High-Throughput, Site-Specific Sample Prep of Ultra-Thin TEM Lamella for Process Metrology and Failure Analysis,” Proc Int. Symp. Test. Fail. Anal. (ISTFA) 2012, p. 391-398. 11. C.S. Bonifacio, P. Nowakowski, M.J. Campin, M.L. Ray, and P.E. Fischione: “Low Energy Ar Ion Milling of FIB TEM Specimens from 14 nm and Future FinFET Technologies,” Proc Int. Symp. Test. Fail. Anal. (ISTFA), 2018, p. 241-246. 12. 14 nm Lithography Process, [Online:2018]., Available: https:// en.wikichip.org/wiki/14_nm_lithography_process. 13. R.F. Egerton: Electron Energy-loss Spectroscopy in the Electron Microscope, 3rd edition, Springer, New York, 2011. 14. K. Iakoubovskii, K. Mitsuishi, Y. Nakayama, andK. Furuya: “Thickness Measurements with Electron Energy Loss Spectroscopy,” Microscopy Research and Technique, 2008, 71 , p. 626-631. 15. S. Jones: “Intel versus GlobalFoundries at the Leading Edge,” IEDM 2017, [Online: 2018], Available: https://www.semiwiki.com/forum/ content/7191-iedm-2017-intel-versus-globalfoundries-leading- edge.html.