August_EDFA_Digital

edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 21 NO. 3 56 Visit the Electronic Device Failure Analysis Society website edfas.org Accelerated Analysis...................................................... 56 Allied High Tech........................................................ 28-29 ASM International................................................... 37 / 55 Checkpoint................................................................ 52-53 Gatan.............................................................................. 33 Hamamatsu. .................................................................... 7 Nikon.............................................................................. 25 Quantum Focus Instruments................................... 3 / 43 Semicaps................................................................... 46-47 TESCAN USA Inc............................................................. 15 ULTRA TEC.................................. Inside front/back covers Zeiss.................................................... Outside back cover For advertising information and rates , contact: Elaine Yusa, Business Development Manager 312.304.1555, elaine.yusa@asminternational.org Current rate card may be viewed online at asminternational.org/mediakit. INDEX OF ADVERTISERS A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS ELECTRONIC DEVICE FAILURE ANALYSIS Visit the Electronic Device Failure Analysis Society website edfas.org PRODUCT NEWS The XYZ piezo stage is driven by ceramic encapsulated preloaded and flexure motion-amplified PICMA piezo actuators that provide better performance and reliability than conventionally insulated piezo actuators. Actuators, guides, and sensors are maintenance-free, not subject to wear, and offer significant lifetime and cost savings. In reliability tests carried out by NASA’s Jet Propulsion Laboratory for the Mars mission, the actuators survived 100 billion cycles without failure. Applications for the P-616 include photonics align- ment,microscopy, 3D imaging, screening, surfaceanalysis, and wafer inspection. Formore information, visit physikinstrumente.com/en. PI’s new NanoCube P-616 scanner (left) compared to the P-611 model (right). CONTINUED FROM PAGE 42

RkJQdWJsaXNoZXIy NzM5NjA4