May_EDFA_Digital

Submicron & Nanoscale 3D X-ray Imaging of Failure Locations Imagine visualizing features and defects buried within intact structures in advanced package 3D architectures. New ZEISS 3D X-ray microscopes (XRM) and a new microCT system provide the ultimate in submicron and nanoscale 3D images to help enable product development, process optimization and failure analysis for advanced semiconductor packages. New Suite of ZEISS 3D X-ray Imaging Solutions • Xradia 620 Versa XRM – the new standard for submicron imaging of fully intact samples now up to two times faster. • Xradia 800 Ultra XRM – nanoscale resolution for imaging ultra-fine pitch interconnects (sample prep required). • Xradia Context microCT system – large field of view for all samples, submicron resolution for small samples. www.zeiss.com/xray-pcs 1 mm 10 µm 3D microCT scan of smartwatch showing SMT components and BGA bump array, 2.85 µm/voxel. 3D image (left); virtual cross section (right) of 25 µm diameter Cu-pillar microbump. DRAM interconnect within a 10 mm x 7 mm x 1 mm package containing 4-die stack, 0.8 μm/voxel, showing solder extrusions; imaged by Xradia 620 Versa. Revealing buried features in advanced packages. ZEISS 3D X-ray Solutions